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ab ch 6 stack 1

Quiz yourself by thinking what should be in each of the black spaces below before clicking on it to display the answer.

Advanced Configuration and Power Interface   Intel Compaq Phoenix Microsfot and Toshiba to contorl power on computers and other devices  
back-side bus   the portion of a processor internal bus that connects the processor to the internal memory cache  
case fan   a fan inside a computer case used to draw air out of or into the case  
Centrino   a technology used by Intel whereby the processor chipset and wireless network adapter are all interconnected as a unit which improves laptop performance  
chassis air guide   a round air duct that help to pull and direct fresh air from outside a computer case to the cooler and processor  
Cool’n’Quiet   a feature of AMD processors that lower power requirements and help keep a system quiet  
Cooler   a combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool  
DRAM   Dynamic RAM  
dual-core processing   Dual processor package that contains 2 core processors thus supporting 4 instructions at once  
Enhanced Intel SpeedStep Technology   A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower  
Execute disable bit   a processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious  
front-side bus   system bus  
heat sink   A piece of metal with cooling fin that can be attached to or mounted on an integrated chip to dissipate heat  
hyper-threading   Technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processor within the package  
hyper transport   allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processor within the package  
internal bus   Inside the processor housing data instructions addresses and control signals  
Level 1   Memory on the processor die used as a cache to improve processor performance  
Level 2   Memory in the processor package but not in the processor die  
Level 3   Cache memory further from the processor core more than level 2  
liquid cooling system   The most popular method of cooling overclocked processors  
memory cache   A small amount of faster RAM that stores recently retrieved data  
Multimedia Extensions   MMX the 1st technology to support repetitive looping  
multi-core processing   The latest advancement in multiple processing  
multiplier   The bus speed or frequency is multiplied to get the CPU clock speed  
multiprocessor   Installing more than one processor on a motherboard  
octo   Processor package that contains 8 cores and supports 16 instructions at once Supporting 16 instructions at once  
overclocking   Running a processor faster than recommended  
PowerNow!   AMD technology that increases performance and lowers power requirements for processor  
processor frequency   the speed that processor runs  
quad core   supporting 8 instructions at once  
S1 state   Hard drive and monitor are turned off and every thing is running normally  
S2 state   Hard drive and monitor and processor is turned off  
S3 state   Sleep mode or standoff mode  
static RAM   RAM chips that retain information without the need for refreshing as long as the computer is on  
stop errors   Error at the kernal level that is severe , and causes the operating system to stop all processes  
thermal compound   Creamlike substance that is placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets  
triple core   Processor pacage that contains 3 core processor  


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Created by: Abenitez96