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ab ch 6 stack 1

Quiz yourself by thinking what should be in each of the black spaces below before clicking on it to display the answer.
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Question
Answer
Advanced Configuration and Power Interface   Intel Compaq Phoenix Microsfot and Toshiba to contorl power on computers and other devices  
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back-side bus   the portion of a processor internal bus that connects the processor to the internal memory cache  
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case fan   a fan inside a computer case used to draw air out of or into the case  
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Centrino   a technology used by Intel whereby the processor chipset and wireless network adapter are all interconnected as a unit which improves laptop performance  
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chassis air guide   a round air duct that help to pull and direct fresh air from outside a computer case to the cooler and processor  
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Cool’n’Quiet   a feature of AMD processors that lower power requirements and help keep a system quiet  
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Cooler   a combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool  
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DRAM   Dynamic RAM  
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dual-core processing   Dual processor package that contains 2 core processors thus supporting 4 instructions at once  
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Enhanced Intel SpeedStep Technology   A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower  
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Execute disable bit   a processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious  
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front-side bus   system bus  
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heat sink   A piece of metal with cooling fin that can be attached to or mounted on an integrated chip to dissipate heat  
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hyper-threading   Technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processor within the package  
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hyper transport   allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processor within the package  
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internal bus   Inside the processor housing data instructions addresses and control signals  
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Level 1   Memory on the processor die used as a cache to improve processor performance  
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Level 2   Memory in the processor package but not in the processor die  
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Level 3   Cache memory further from the processor core more than level 2  
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liquid cooling system   The most popular method of cooling overclocked processors  
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memory cache   A small amount of faster RAM that stores recently retrieved data  
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Multimedia Extensions   MMX the 1st technology to support repetitive looping  
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multi-core processing   The latest advancement in multiple processing  
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multiplier   The bus speed or frequency is multiplied to get the CPU clock speed  
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multiprocessor   Installing more than one processor on a motherboard  
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octo   Processor package that contains 8 cores and supports 16 instructions at once Supporting 16 instructions at once  
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overclocking   Running a processor faster than recommended  
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PowerNow!   AMD technology that increases performance and lowers power requirements for processor  
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processor frequency   the speed that processor runs  
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quad core   supporting 8 instructions at once  
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S1 state   Hard drive and monitor are turned off and every thing is running normally  
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S2 state   Hard drive and monitor and processor is turned off  
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S3 state   Sleep mode or standoff mode  
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static RAM   RAM chips that retain information without the need for refreshing as long as the computer is on  
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stop errors   Error at the kernal level that is severe , and causes the operating system to stop all processes  
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thermal compound   Creamlike substance that is placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets  
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triple core   Processor pacage that contains 3 core processor  
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Created by: Abenitez96
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