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ab ch 6 stack 1
| Question | Answer |
|---|---|
| Advanced Configuration and Power Interface | Intel Compaq Phoenix Microsfot and Toshiba to contorl power on computers and other devices |
| back-side bus | the portion of a processor internal bus that connects the processor to the internal memory cache |
| case fan | a fan inside a computer case used to draw air out of or into the case |
| Centrino | a technology used by Intel whereby the processor chipset and wireless network adapter are all interconnected as a unit which improves laptop performance |
| chassis air guide | a round air duct that help to pull and direct fresh air from outside a computer case to the cooler and processor |
| Cool’n’Quiet | a feature of AMD processors that lower power requirements and help keep a system quiet |
| Cooler | a combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool |
| DRAM | Dynamic RAM |
| dual-core processing | Dual processor package that contains 2 core processors thus supporting 4 instructions at once |
| Enhanced Intel SpeedStep Technology | A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower |
| Execute disable bit | a processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious |
| front-side bus | system bus |
| heat sink | A piece of metal with cooling fin that can be attached to or mounted on an integrated chip to dissipate heat |
| hyper-threading | Technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processor within the package |
| hyper transport | allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processor within the package |
| internal bus | Inside the processor housing data instructions addresses and control signals |
| Level 1 | Memory on the processor die used as a cache to improve processor performance |
| Level 2 | Memory in the processor package but not in the processor die |
| Level 3 | Cache memory further from the processor core more than level 2 |
| liquid cooling system | The most popular method of cooling overclocked processors |
| memory cache | A small amount of faster RAM that stores recently retrieved data |
| Multimedia Extensions | MMX the 1st technology to support repetitive looping |
| multi-core processing | The latest advancement in multiple processing |
| multiplier | The bus speed or frequency is multiplied to get the CPU clock speed |
| multiprocessor | Installing more than one processor on a motherboard |
| octo | Processor package that contains 8 cores and supports 16 instructions at once Supporting 16 instructions at once |
| overclocking | Running a processor faster than recommended |
| PowerNow! | AMD technology that increases performance and lowers power requirements for processor |
| processor frequency | the speed that processor runs |
| quad core | supporting 8 instructions at once |
| S1 state | Hard drive and monitor are turned off and every thing is running normally |
| S2 state | Hard drive and monitor and processor is turned off |
| S3 state | Sleep mode or standoff mode |
| static RAM | RAM chips that retain information without the need for refreshing as long as the computer is on |
| stop errors | Error at the kernal level that is severe , and causes the operating system to stop all processes |
| thermal compound | Creamlike substance that is placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets |
| triple core | Processor pacage that contains 3 core processor |