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ab ch 6 stack 1

Advanced Configuration and Power Interface Intel Compaq Phoenix Microsfot and Toshiba to contorl power on computers and other devices
back-side bus the portion of a processor internal bus that connects the processor to the internal memory cache
case fan a fan inside a computer case used to draw air out of or into the case
Centrino a technology used by Intel whereby the processor chipset and wireless network adapter are all interconnected as a unit which improves laptop performance
chassis air guide a round air duct that help to pull and direct fresh air from outside a computer case to the cooler and processor
Cool’n’Quiet a feature of AMD processors that lower power requirements and help keep a system quiet
Cooler a combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool
DRAM Dynamic RAM
dual-core processing Dual processor package that contains 2 core processors thus supporting 4 instructions at once
Enhanced Intel SpeedStep Technology A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower
Execute disable bit a processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious
front-side bus system bus
heat sink A piece of metal with cooling fin that can be attached to or mounted on an integrated chip to dissipate heat
hyper-threading Technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processor within the package
hyper transport allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processor within the package
internal bus Inside the processor housing data instructions addresses and control signals
Level 1 Memory on the processor die used as a cache to improve processor performance
Level 2 Memory in the processor package but not in the processor die
Level 3 Cache memory further from the processor core more than level 2
liquid cooling system The most popular method of cooling overclocked processors
memory cache A small amount of faster RAM that stores recently retrieved data
Multimedia Extensions MMX the 1st technology to support repetitive looping
multi-core processing The latest advancement in multiple processing
multiplier The bus speed or frequency is multiplied to get the CPU clock speed
multiprocessor Installing more than one processor on a motherboard
octo Processor package that contains 8 cores and supports 16 instructions at once Supporting 16 instructions at once
overclocking Running a processor faster than recommended
PowerNow! AMD technology that increases performance and lowers power requirements for processor
processor frequency the speed that processor runs
quad core supporting 8 instructions at once
S1 state Hard drive and monitor are turned off and every thing is running normally
S2 state Hard drive and monitor and processor is turned off
S3 state Sleep mode or standoff mode
static RAM RAM chips that retain information without the need for refreshing as long as the computer is on
stop errors Error at the kernal level that is severe , and causes the operating system to stop all processes
thermal compound Creamlike substance that is placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets
triple core Processor pacage that contains 3 core processor
Created by: Abenitez96