ab ch 6 stack 1 Word Scramble
|
Embed Code - If you would like this activity on your web page, copy the script below and paste it into your web page.
Normal Size Small Size show me how
Normal Size Small Size show me how
Question | Answer |
Advanced Configuration and Power Interface | Intel Compaq Phoenix Microsfot and Toshiba to contorl power on computers and other devices |
back-side bus | the portion of a processor internal bus that connects the processor to the internal memory cache |
case fan | a fan inside a computer case used to draw air out of or into the case |
Centrino | a technology used by Intel whereby the processor chipset and wireless network adapter are all interconnected as a unit which improves laptop performance |
chassis air guide | a round air duct that help to pull and direct fresh air from outside a computer case to the cooler and processor |
Cool’n’Quiet | a feature of AMD processors that lower power requirements and help keep a system quiet |
Cooler | a combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool |
DRAM | Dynamic RAM |
dual-core processing | Dual processor package that contains 2 core processors thus supporting 4 instructions at once |
Enhanced Intel SpeedStep Technology | A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower |
Execute disable bit | a processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious |
front-side bus | system bus |
heat sink | A piece of metal with cooling fin that can be attached to or mounted on an integrated chip to dissipate heat |
hyper-threading | Technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processor within the package |
hyper transport | allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processor within the package |
internal bus | Inside the processor housing data instructions addresses and control signals |
Level 1 | Memory on the processor die used as a cache to improve processor performance |
Level 2 | Memory in the processor package but not in the processor die |
Level 3 | Cache memory further from the processor core more than level 2 |
liquid cooling system | The most popular method of cooling overclocked processors |
memory cache | A small amount of faster RAM that stores recently retrieved data |
Multimedia Extensions | MMX the 1st technology to support repetitive looping |
multi-core processing | The latest advancement in multiple processing |
multiplier | The bus speed or frequency is multiplied to get the CPU clock speed |
multiprocessor | Installing more than one processor on a motherboard |
octo | Processor package that contains 8 cores and supports 16 instructions at once Supporting 16 instructions at once |
overclocking | Running a processor faster than recommended |
PowerNow! | AMD technology that increases performance and lowers power requirements for processor |
processor frequency | the speed that processor runs |
quad core | supporting 8 instructions at once |
S1 state | Hard drive and monitor are turned off and every thing is running normally |
S2 state | Hard drive and monitor and processor is turned off |
S3 state | Sleep mode or standoff mode |
static RAM | RAM chips that retain information without the need for refreshing as long as the computer is on |
stop errors | Error at the kernal level that is severe , and causes the operating system to stop all processes |
thermal compound | Creamlike substance that is placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets |
triple core | Processor pacage that contains 3 core processor |
Created by:
Abenitez96
Popular Computers sets