mm ch6stack1 Word Scramble
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Term | Definition |
Level 1 cache | Memory on the processor die. |
Level 2 cache | Memory in the processor package, but not the processor die. |
Level 3 cache | Some processor use a third cache farther from the processor core, but still in the processor package. |
Hyper threading | Intel's technology used by processors. |
Hyper transport | AMD's technology used by processors. |
Front-side bus(FSB) | Connects to the front side of the processor. |
Internal bus | The data portion of the bus. |
Back-side bus (BSB) | The portion of the internal bus that connects the processor to the internal memory cache. |
Processor frequency | The speed at which the processor operates internally. |
Multiplier | The processor operating at four times the system bus frequency. |
Overclocking | Running a motherboard o processor at a higher speed than the manufacturer suggests. |
Multiprocessor platform | A second method of improving performance is installing more than one processor on a motherboard, crating a multiprocessor platform. |
Multi-core processing | The latest advancement in multiple processing. |
Dual core | Supporting four instructions at once. |
Triple core | Supporting six instructions at once. |
Quad core | Supporting eight instructions at once. |
Octo core | Supporting sixteen instructions at once. |
Memory cache | RAM that holds data and instructions that the memory controller anticipates the processor the processor will need next. |
Dynamic RAM | RAM stored modules on the mother board, |
Static RAM | Memory in a memory cache. |
MMX (Multimedia Extensions) | The first technology to support to support repetitive looping. |
Cool’n’Quiet | By AMD, lowers power requirements and helps keep a system quiet. |
Enhanced Intel SpeedStep Technology (EIST) | Steps down processor frequency when the processor is idle to conserve power and lower heat. |
Execute disable bit | A security feature that prevents software from executing or reproducing itself if it appears to be malicious. |
Centrino | The Intel processor, chip set, and wireless network adapter are all interconnected in a unit, which improves laptop performance. |
Cooler | The cooler sits on top of the processor and consists of a fan and a heat sink. |
Heat sink | Fins that draw heat away from the processor. |
Thermal compound | Placed between the bottom of the cooler heat sink and on the top of the processor. |
Case fan | Helps draw air out of the case. |
liquid cooling system | A small pump that sits inside the computer case, and tubes move water or other liquids around components. |
S1 state | The hard drive, monitor, and processor are turned off. Also referred to as standby or sleep mode. |
S2 state | The hard drive, monitor, and processor are turned off. Also called standby or sleep mode. |
S3 state | Also called hibernation. Boots the system without the boot process. |
chassis air guide (CAG) | A round air duct that helps to pull and direct fresh air from the case. |
Power Now! | Increases performance and lowers power requirements. |
Advanced Configuration and power interference (ACPI) | The current set of standards that is used by BIOS, hardware, and the OS to manage power. |
Stop errors | Usually caused by viruses, errors in the file system, a corrupted hard drive, a corrupted system file, or a hardware problem. |
Created by:
Michael Miller
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