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Level 1 cache Memory on the processor die.
Level 2 cache Memory in the processor package, but not the processor die.
Level 3 cache Some processor use a third cache farther from the processor core, but still in the processor package.
Hyper threading Intel's technology used by processors.
Hyper transport AMD's technology used by processors.
Front-side bus(FSB) Connects to the front side of the processor.
Internal bus The data portion of the bus.
Back-side bus (BSB) The portion of the internal bus that connects the processor to the internal memory cache.
Processor frequency The speed at which the processor operates internally.
Multiplier The processor operating at four times the system bus frequency.
Overclocking Running a motherboard o processor at a higher speed than the manufacturer suggests.
Multiprocessor platform A second method of improving performance is installing more than one processor on a motherboard, crating a multiprocessor platform.
Multi-core processing The latest advancement in multiple processing.
Dual core Supporting four instructions at once.
Triple core Supporting six instructions at once.
Quad core Supporting eight instructions at once.
Octo core Supporting sixteen instructions at once.
Memory cache RAM that holds data and instructions that the memory controller anticipates the processor the processor will need next.
Dynamic RAM RAM stored modules on the mother board,
Static RAM Memory in a memory cache.
MMX (Multimedia Extensions) The first technology to support to support repetitive looping.
Cool’n’Quiet By AMD, lowers power requirements and helps keep a system quiet.
Enhanced Intel SpeedStep Technology (EIST) Steps down processor frequency when the processor is idle to conserve power and lower heat.
Execute disable bit A security feature that prevents software from executing or reproducing itself if it appears to be malicious.
Centrino The Intel processor, chip set, and wireless network adapter are all interconnected in a unit, which improves laptop performance.
Cooler The cooler sits on top of the processor and consists of a fan and a heat sink.
Heat sink Fins that draw heat away from the processor.
Thermal compound Placed between the bottom of the cooler heat sink and on the top of the processor.
Case fan Helps draw air out of the case.
liquid cooling system A small pump that sits inside the computer case, and tubes move water or other liquids around components.
S1 state The hard drive, monitor, and processor are turned off. Also referred to as standby or sleep mode.
S2 state The hard drive, monitor, and processor are turned off. Also called standby or sleep mode.
S3 state Also called hibernation. Boots the system without the boot process.
chassis air guide (CAG) A round air duct that helps to pull and direct fresh air from the case.
Power Now! Increases performance and lowers power requirements.
Advanced Configuration and power interference (ACPI) The current set of standards that is used by BIOS, hardware, and the OS to manage power.
Stop errors Usually caused by viruses, errors in the file system, a corrupted hard drive, a corrupted system file, or a hardware problem.
Created by: Michael Miller