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nm-ch6-stack1

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Term
Definition
Advanced Configuration and Power Interface (ACPI)   specification advanced config developed by intel, compaq, phoenix  
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back-side bus (BSB)   Portion of the back bus operates at a much higher frequency than the external bus.  
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case fan   A fan inside a computer case used to draw air out of or into the case.  
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Centrino   A technology used by Intel whereby the processor, chipset, and wireless network adapter are all interconnected as a unit which improves centrino laptop performance.  
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chassis air guide (CAG)   This air guide is a round air duct that helps to pull and direct fresh air from outside the case to the cooler and processor.  
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Cool’n’Quiet   AMD lowers power requirements and helps keep a system quiet.  
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Cooler   sits on top of the cooler processor and consists of a fan  
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DRAM   RAM stored in memory modules on the mother board  
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dual-core processing   supports duel four instructions  
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Enhanced Intel SpeedStep Technology (EIST)   Intel steps down processor frequency when the processor is idle to conserve power and lower heat.  
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Execute disable bit   Intel is a security feature that prevents software from executing bit or reproducing iteself if it appears to be malicious  
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front-side bus (FSB)   Connects the front side of the processor that faces the outside world.  
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heat sink   fins that draw heat away from the processor  
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hyper-threading   the best-known technologies used by processors  
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hyper transport   all each logical processor with the processor package to handle an individual thread in parallel with other threads transport being handled by other processors within the package.  
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internal bus   Inside the processor housing, data, instructions, addresses, and control signals.  
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Created by: nickmulvenna6
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