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nm-ch6-stack1

TermDefinition
Advanced Configuration and Power Interface (ACPI) specification advanced config developed by intel, compaq, phoenix
back-side bus (BSB) Portion of the back bus operates at a much higher frequency than the external bus.
case fan A fan inside a computer case used to draw air out of or into the case.
Centrino A technology used by Intel whereby the processor, chipset, and wireless network adapter are all interconnected as a unit which improves centrino laptop performance.
chassis air guide (CAG) This air guide is a round air duct that helps to pull and direct fresh air from outside the case to the cooler and processor.
Cool’n’Quiet AMD lowers power requirements and helps keep a system quiet.
Cooler sits on top of the cooler processor and consists of a fan
DRAM RAM stored in memory modules on the mother board
dual-core processing supports duel four instructions
Enhanced Intel SpeedStep Technology (EIST) Intel steps down processor frequency when the processor is idle to conserve power and lower heat.
Execute disable bit Intel is a security feature that prevents software from executing bit or reproducing iteself if it appears to be malicious
front-side bus (FSB) Connects the front side of the processor that faces the outside world.
heat sink fins that draw heat away from the processor
hyper-threading the best-known technologies used by processors
hyper transport all each logical processor with the processor package to handle an individual thread in parallel with other threads transport being handled by other processors within the package.
internal bus Inside the processor housing, data, instructions, addresses, and control signals.
Created by: nickmulvenna6
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