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Chapter 6 stack 1

Quiz yourself by thinking what should be in each of the black spaces below before clicking on it to display the answer.
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Term
Definition
Advanced Configuration and Power Interface (ACPI)   Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices.  
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back-side bus (BSB)   The portion of the internal bus that connects the processor to the internal memory cache called the BSB  
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case fan   This helps draw air out of the case.  
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Centrino   Using this intel processor, chipset, and wireless network adapter are all interconnected as a unit, which improves the laptop performance.  
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chassis air guide (CAG)   a round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor.  
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Cool’n’Quiet   by AMD lowers power requirements and helps keep a system quiet.  
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Cooler   A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool.  
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DRAM   memory stored on memory modules on the motherboard; loses data rapidly and must refresh often  
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dual-core processing   supports four instructions at once  
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Enhanced Intel SpeedStep Technology (EIST)   by Intel steps down processor frequency when the processor is idle to conserve power and lower heat.  
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Execute disable bit   Is a intel is a security feature that prevents software from executing or reproducing itself if it appears to be malicious.  
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front-side bus (FSB)   Because it connects to the front side of the processor that faces the outside world.  
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heat sink   A piece of metal, with cooling fins, that can be attached to or mounted on an integrated chip (such as the CPU) to dissipate heat.  
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hyper transport   allow each logical processor within the processor package to handle an individual thread in parallel with other threads by other processors within the package  
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internal bus   data/instruction/control signals portion of the bus, 32 bits wide.  
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Level 1 (L1) cache   memory on the processor die; also called L1  
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Level 2 (L2) cache   memory in the processor package but not on the die; also called L2  
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Level 3 (L3) cache   memory farther from the processor core but still in the package; also called L3  
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liquid cooling system   The most popular method of cooling a processors. A small pump sits inside of the computer case, and tubes move water or other liquid around the components and then away from them to a place where fans can cool the liquid.  
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memory cache   a small amount of faster RAM that stores recently retrieved data, in anticipation of what the CPU will request next, thus speeding up access.  
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MMX (Multimedia Extensions)   Was the first technology to support repetitive looping, Where by the processor receives an instruction and then applies it to a stream of data process it.  
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multi-core processing   processor housing contains two or more cores that operate at the same frequency, but independently of each other.  
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multiplier   In the case the processor operates at four times the system bus frequency. If you multiply the system bus frequency by the multiplier you get the processor frequency  
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multiprocessor   able to utilize more than one processor  
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octo   supporting sixteen instructions at once  
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overclocking   Running a motherboard or processor at a higher speed than the manufacturer suggested is called overclocking and it is not recommended because the speed is not guaranteed to be stable.  
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PowerNow   by AMd increases performance and lowers power requirements.  
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processor frequency   speed at which the processor operates internally  
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quad core   supports eight instructions at once  
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S1 state   Hard drive is turned off and everything else runs normally. Sleep mode.  
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S2 state   The hard drive, monitor, and processor are turned off.  
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S3 state   Everything is shut down except RAM.  
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static RAM (SRAM)   memory stored in a memory cache  
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stop errors   An error at the kernel level that is severe enough to cause the operating system to stop all processes.  
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thermal compound   this is placed between the bottom of the cooler heat sink and the top of the processor.  
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triple core   supports six instructions at once  
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