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Chapter 6 stack 1

Advanced Configuration and Power Interface (ACPI) Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices.
back-side bus (BSB) The portion of the internal bus that connects the processor to the internal memory cache called the BSB
case fan This helps draw air out of the case.
Centrino Using this intel processor, chipset, and wireless network adapter are all interconnected as a unit, which improves the laptop performance.
chassis air guide (CAG) a round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor.
Cool’n’Quiet by AMD lowers power requirements and helps keep a system quiet.
Cooler A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool.
DRAM memory stored on memory modules on the motherboard; loses data rapidly and must refresh often
dual-core processing supports four instructions at once
Enhanced Intel SpeedStep Technology (EIST) by Intel steps down processor frequency when the processor is idle to conserve power and lower heat.
Execute disable bit Is a intel is a security feature that prevents software from executing or reproducing itself if it appears to be malicious.
front-side bus (FSB) Because it connects to the front side of the processor that faces the outside world.
heat sink A piece of metal, with cooling fins, that can be attached to or mounted on an integrated chip (such as the CPU) to dissipate heat.
hyper transport allow each logical processor within the processor package to handle an individual thread in parallel with other threads by other processors within the package
internal bus data/instruction/control signals portion of the bus, 32 bits wide.
Level 1 (L1) cache memory on the processor die; also called L1
Level 2 (L2) cache memory in the processor package but not on the die; also called L2
Level 3 (L3) cache memory farther from the processor core but still in the package; also called L3
liquid cooling system The most popular method of cooling a processors. A small pump sits inside of the computer case, and tubes move water or other liquid around the components and then away from them to a place where fans can cool the liquid.
memory cache a small amount of faster RAM that stores recently retrieved data, in anticipation of what the CPU will request next, thus speeding up access.
MMX (Multimedia Extensions) Was the first technology to support repetitive looping, Where by the processor receives an instruction and then applies it to a stream of data process it.
multi-core processing processor housing contains two or more cores that operate at the same frequency, but independently of each other.
multiplier In the case the processor operates at four times the system bus frequency. If you multiply the system bus frequency by the multiplier you get the processor frequency
multiprocessor able to utilize more than one processor
octo supporting sixteen instructions at once
overclocking Running a motherboard or processor at a higher speed than the manufacturer suggested is called overclocking and it is not recommended because the speed is not guaranteed to be stable.
PowerNow by AMd increases performance and lowers power requirements.
processor frequency speed at which the processor operates internally
quad core supports eight instructions at once
S1 state Hard drive is turned off and everything else runs normally. Sleep mode.
S2 state The hard drive, monitor, and processor are turned off.
S3 state Everything is shut down except RAM.
static RAM (SRAM) memory stored in a memory cache
stop errors An error at the kernel level that is severe enough to cause the operating system to stop all processes.
thermal compound this is placed between the bottom of the cooler heat sink and the top of the processor.
triple core supports six instructions at once
Created by: 13rmccammitt