JK chp6 stack 1
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each of the black spaces below before clicking
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| Level 1 cache (L1 cache) | Memory on the processor die.
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| Level 2 cache (L2 cache) | Memory in the processor package , but not on the processor die.
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| Level 3 cache (L3 cache) | This id farther from the processor core, but still in the processor package.
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| Hyper-Threading | Allows each logical processor within the processor package to handle an individual thread in parallel with other treads being handled by other processors within the package.
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| Hyper-Transport | Allows each logical processor within the processor package to handle an individual thread in parallel with other treads being handled by other processors within the package.
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| Front-side bus(FSB) | Connects to the front side of the processor that faces the outside world.
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| Internal bus | Is used inside the processor housing, data, instructions, addresses, and control signals.
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| Back-side bus(BSB) | The portion of the internal bus that connects the processor to the internal memory cache.
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| Processor frequency | The speed at which the processor operates internally.
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| Multiplier | Is when the processor operates at four times the system bus frequency.
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| Overclocking | Running the motherboard or processor at a higher speed than the manufacturer suggests.
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| Multiprocessor platform | Installing more than one processor on a motherboard.
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| Multi-core processing | The processor housing contains two or more cores that operate at the same frequency, but independently of each other.
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| Dual core | Supporting four instructions at once,two cores.
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| Triple core | Supporting six instructions at once,three cores.
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| Quad core | Supporting eight instructions at once, four cores.
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| Octo core | Supporting sixteen instructions at once, eight cores
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| Memory cache | RAM that holds data and instructions that the memory controller anticipates the processor will need next.
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| Dynamic RAM (DRAM) | RAM stored in memory modules (DIMMs) on the motherboard, pronounced "D-Ram".
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| Static RAM (SRAM) | Memory in a memory cache, pronounced "S-Ram".
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| MMX(Multimedia Extensions) | 1st technology to support repetitive looping,the processor receives an instruction and then applies it to a stream of data that follows.
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| PowerNow! | Increases performance and lowers power requirements.
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| Cool'n'Quiet | Lowers power requirements and helps keep a system quite.
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| Enhanced Intel SpeedStep Technology(EIST) | Steps down processor frequency when the processor is idle to conserve power and lower heat.
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| Execute Disable Bit | A security feature that prevents software from executing or reproducing itself if it appears to be malicious.
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| Centrino | Improves lab top performance by interconnecting the Intel processor, chip set, and wireless network adapter as a unit.
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| Cooler | Sits on top of the processor and consists of a fan and a heat sink.
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| Heat sink | Fans that draw heat away from the processor.
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| Thermal compound | Placed between the bottom of the cooler,heat sink,and the top of the processor.
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| Case fan | Helps draw air out of the case.
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| Liquid cooling system | A small pump sits inside the computer case and tubes move water or other liquid around components and then away from them to a place where the fans can cool the liquid.
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| S1 state | The hard drive and monitor are turned off and everything else runs normally.
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| S2 state | The hard drive, monitor, and processor are turned off.
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| S3 state | Everything is shut down except RAM and enough of the system to respond to a wake up call such as pressing the key board or moving the mouse.
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| Chassis air guide(CAG) | A round air duct that helps to pull and direct fresh air from outside the case to the cooler and the processor.
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| Advanced Configuration and Power Interference(ACPI) | The current set of standards that is used by BIOS, hardware, and the OS to manage power.
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| Stop Errors | Usually caused by viruses, errors in the file system, a corrupted hard drive, a corrupted system file, or a hardware problem.
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