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JK chp6 stack 1

Level 1 cache (L1 cache) Memory on the processor die.
Level 2 cache (L2 cache) Memory in the processor package , but not on the processor die.
Level 3 cache (L3 cache) This id farther from the processor core, but still in the processor package.
Hyper-Threading Allows each logical processor within the processor package to handle an individual thread in parallel with other treads being handled by other processors within the package.
Hyper-Transport Allows each logical processor within the processor package to handle an individual thread in parallel with other treads being handled by other processors within the package.
Front-side bus(FSB) Connects to the front side of the processor that faces the outside world.
Internal bus Is used inside the processor housing, data, instructions, addresses, and control signals.
Back-side bus(BSB) The portion of the internal bus that connects the processor to the internal memory cache.
Processor frequency The speed at which the processor operates internally.
Multiplier Is when the processor operates at four times the system bus frequency.
Overclocking Running the motherboard or processor at a higher speed than the manufacturer suggests.
Multiprocessor platform Installing more than one processor on a motherboard.
Multi-core processing The processor housing contains two or more cores that operate at the same frequency, but independently of each other.
Dual core Supporting four instructions at once,two cores.
Triple core Supporting six instructions at once,three cores.
Quad core Supporting eight instructions at once, four cores.
Octo core Supporting sixteen instructions at once, eight cores
Memory cache RAM that holds data and instructions that the memory controller anticipates the processor will need next.
Dynamic RAM (DRAM) RAM stored in memory modules (DIMMs) on the motherboard, pronounced "D-Ram".
Static RAM (SRAM) Memory in a memory cache, pronounced "S-Ram".
MMX(Multimedia Extensions) 1st technology to support repetitive looping,the processor receives an instruction and then applies it to a stream of data that follows.
PowerNow! Increases performance and lowers power requirements.
Cool'n'Quiet Lowers power requirements and helps keep a system quite.
Enhanced Intel SpeedStep Technology(EIST) Steps down processor frequency when the processor is idle to conserve power and lower heat.
Execute Disable Bit A security feature that prevents software from executing or reproducing itself if it appears to be malicious.
Centrino Improves lab top performance by interconnecting the Intel processor, chip set, and wireless network adapter as a unit.
Cooler Sits on top of the processor and consists of a fan and a heat sink.
Heat sink Fans that draw heat away from the processor.
Thermal compound Placed between the bottom of the cooler,heat sink,and the top of the processor.
Case fan Helps draw air out of the case.
Liquid cooling system A small pump sits inside the computer case and tubes move water or other liquid around components and then away from them to a place where the fans can cool the liquid.
S1 state The hard drive and monitor are turned off and everything else runs normally.
S2 state The hard drive, monitor, and processor are turned off.
S3 state Everything is shut down except RAM and enough of the system to respond to a wake up call such as pressing the key board or moving the mouse.
Chassis air guide(CAG) A round air duct that helps to pull and direct fresh air from outside the case to the cooler and the processor.
Advanced Configuration and Power Interference(ACPI) The current set of standards that is used by BIOS, hardware, and the OS to manage power.
Stop Errors Usually caused by viruses, errors in the file system, a corrupted hard drive, a corrupted system file, or a hardware problem.
Created by: 13jkahn