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JK chp6 stack 1
Term | Definition |
---|---|
Level 1 cache (L1 cache) | Memory on the processor die. |
Level 2 cache (L2 cache) | Memory in the processor package , but not on the processor die. |
Level 3 cache (L3 cache) | This id farther from the processor core, but still in the processor package. |
Hyper-Threading | Allows each logical processor within the processor package to handle an individual thread in parallel with other treads being handled by other processors within the package. |
Hyper-Transport | Allows each logical processor within the processor package to handle an individual thread in parallel with other treads being handled by other processors within the package. |
Front-side bus(FSB) | Connects to the front side of the processor that faces the outside world. |
Internal bus | Is used inside the processor housing, data, instructions, addresses, and control signals. |
Back-side bus(BSB) | The portion of the internal bus that connects the processor to the internal memory cache. |
Processor frequency | The speed at which the processor operates internally. |
Multiplier | Is when the processor operates at four times the system bus frequency. |
Overclocking | Running the motherboard or processor at a higher speed than the manufacturer suggests. |
Multiprocessor platform | Installing more than one processor on a motherboard. |
Multi-core processing | The processor housing contains two or more cores that operate at the same frequency, but independently of each other. |
Dual core | Supporting four instructions at once,two cores. |
Triple core | Supporting six instructions at once,three cores. |
Quad core | Supporting eight instructions at once, four cores. |
Octo core | Supporting sixteen instructions at once, eight cores |
Memory cache | RAM that holds data and instructions that the memory controller anticipates the processor will need next. |
Dynamic RAM (DRAM) | RAM stored in memory modules (DIMMs) on the motherboard, pronounced "D-Ram". |
Static RAM (SRAM) | Memory in a memory cache, pronounced "S-Ram". |
MMX(Multimedia Extensions) | 1st technology to support repetitive looping,the processor receives an instruction and then applies it to a stream of data that follows. |
PowerNow! | Increases performance and lowers power requirements. |
Cool'n'Quiet | Lowers power requirements and helps keep a system quite. |
Enhanced Intel SpeedStep Technology(EIST) | Steps down processor frequency when the processor is idle to conserve power and lower heat. |
Execute Disable Bit | A security feature that prevents software from executing or reproducing itself if it appears to be malicious. |
Centrino | Improves lab top performance by interconnecting the Intel processor, chip set, and wireless network adapter as a unit. |
Cooler | Sits on top of the processor and consists of a fan and a heat sink. |
Heat sink | Fans that draw heat away from the processor. |
Thermal compound | Placed between the bottom of the cooler,heat sink,and the top of the processor. |
Case fan | Helps draw air out of the case. |
Liquid cooling system | A small pump sits inside the computer case and tubes move water or other liquid around components and then away from them to a place where the fans can cool the liquid. |
S1 state | The hard drive and monitor are turned off and everything else runs normally. |
S2 state | The hard drive, monitor, and processor are turned off. |
S3 state | Everything is shut down except RAM and enough of the system to respond to a wake up call such as pressing the key board or moving the mouse. |
Chassis air guide(CAG) | A round air duct that helps to pull and direct fresh air from outside the case to the cooler and the processor. |
Advanced Configuration and Power Interference(ACPI) | The current set of standards that is used by BIOS, hardware, and the OS to manage power. |
Stop Errors | Usually caused by viruses, errors in the file system, a corrupted hard drive, a corrupted system file, or a hardware problem. |