Question | Answer |
Advanced Configuration and Power Interface (ACPI) | Provides an open standard for device configuration and ACPI power management |
back-side bus (BSB) | Is a computer bus BSB used to connect the CPU to CPU cache memory |
case fan | A computer CaseFan is any fan inside a computer case used for cooling purposes |
Centrino | The new product line name for Intel wireless products is Intel Centrino Wireless |
chassis air guide (CAG) | Intel's thermal system to CAGPC chassis |
Cool’n’Quiet | A CPU speed throttling and power saving technology introduced by cool'n'quiet AMD with its Athlon 64 processor line |
Cooler | A device that draws heat away from a CPU cooler chip and other hot-running chips |
DRAM | is a type of random-access memory that stores each bit of DRAM data in a separate capacitor within an integrated circuit |
dual-core processing | A CPU with two dual-core separate cores and thus two separate caches |
Enhanced Intel SpeedStep Technology (EIST) | reduces the latency EIST associated with changing the voltage/frequency pair |
Execute disable bit | is an Intel hardware-based security component used in the central processing unit (CPU) to separate areas of a memory disable bit |
front-side bus (FSB) | is a computer communication interface front side(bus) often used in Intel-chip-based computers |
heat sink | s a passive heat exchanger component that cools a device by dissipating heatsink into the surrounding air |
hyper-threading | uses processor resources more efficiently, enabling multiple hyper threads to run on each core. |
hyper transport | is a high-speed, low latency, point-to-point link designed to hyper transport increase the communication speed between integrated circuits |
internal bus | also known as Internal data bus, memory bus or system bus or front-Side-Bus, connects all the internal components of a computer |
Level 1 (L1) cache | often called primary cache, is a static memory integrated L1 with processor core that is used to store information recently accessed |
Level 2 (L2) cache | also called secondary cache, is a memory that is used to L2 store recently accessed information. |
Level 3 (L3) cache | is specialized memory that works hand-in-hand with L3 and L3 cache to improve computer performance |
liquid cooling system | makes use of evaporative liquid cooling, lowering the temp of the CPU |
memory cache | a collection of cache data duplicating original values stored elsewhere on a computer |
MMX (Multimedia Extensions) | , a set of 57 multimedia instructions built into Intel microprocessors and other x86-compatible MMX microprocessors |
multi-core processing | is a single computing component with two or more independent actual central multi-core processing units (called "cores") |
multiplier | is a factor of proportionality that measures how much an multiplier endogenous variable changes |
multiprocessor | is the use of a multiprocessor two or more central processing units (CPUs) within a single computer system. |
octo | office of chief technology |
overclocking | is the process of making a computer or component operate faster than the overclock frequency specified by the manufacturer |
PowerNow! | is speed throttling Powernow! and power saving technology of AMD's processors used in laptops. |
processor frequency | Micro processor frequency specifies the operating (internal) frequency of CPU's core. |
quad core | processor for quadcore desktop PCs deliver greater performance for the most demanding multitasking environments. |
S1 state | All processor S1 caches are flushed, and the CPU(s) stops executing instructions |
S2 state | sleeping state S2 |
S3 state | Commonly refer S3red to as Standby, Sleep, or Suspend to RAM |
static RAM (SRAM) | differentiates it from dynamic RAM (DRAM) which must be periodically refreshed. SRAM exhibits data remanence |
stop errors | A complete list of Windows STOP codes, often called Blue Screen stop error codes. STOP codes display |
thermal compound | also called thermal paste or thermal compound, is a substance used to promote better heat conduction between two surfaces |
triple core | A single chip with three distinct processors that work simultaneously |