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TT Ch6 Stack 1

Advanced Configuration and Power Interface (ACPI) Provides an open standard for device configuration and ACPI power management
back-side bus (BSB) Is a computer bus BSB used to connect the CPU to CPU cache memory
case fan A computer CaseFan is any fan inside a computer case used for cooling purposes
Centrino The new product line name for Intel wireless products is Intel Centrino Wireless
chassis air guide (CAG) Intel's thermal system to CAGPC chassis
Cool’n’Quiet A CPU speed throttling and power saving technology introduced by cool'n'quiet AMD with its Athlon 64 processor line
Cooler A device that draws heat away from a CPU cooler chip and other hot-running chips
DRAM is a type of random-access memory that stores each bit of DRAM data in a separate capacitor within an integrated circuit
dual-core processing A CPU with two dual-core separate cores and thus two separate caches
Enhanced Intel SpeedStep Technology (EIST) reduces the latency EIST associated with changing the voltage/frequency pair
Execute disable bit is an Intel hardware-based security component used in the central processing unit (CPU) to separate areas of a memory disable bit
front-side bus (FSB) is a computer communication interface front side(bus) often used in Intel-chip-based computers
heat sink s a passive heat exchanger component that cools a device by dissipating heatsink into the surrounding air
hyper-threading uses processor resources more efficiently, enabling multiple hyper threads to run on each core.
hyper transport is a high-speed, low latency, point-to-point link designed to hyper transport increase the communication speed between integrated circuits
internal bus also known as Internal data bus, memory bus or system bus or front-Side-Bus, connects all the internal components of a computer
Level 1 (L1) cache often called primary cache, is a static memory integrated L1 with processor core that is used to store information recently accessed
Level 2 (L2) cache also called secondary cache, is a memory that is used to L2 store recently accessed information.
Level 3 (L3) cache is specialized memory that works hand-in-hand with L3 and L3 cache to improve computer performance
liquid cooling system makes use of evaporative liquid cooling, lowering the temp of the CPU
memory cache a collection of cache data duplicating original values stored elsewhere on a computer
MMX (Multimedia Extensions) , a set of 57 multimedia instructions built into Intel microprocessors and other x86-compatible MMX microprocessors
multi-core processing is a single computing component with two or more independent actual central multi-core processing units (called "cores")
multiplier is a factor of proportionality that measures how much an multiplier endogenous variable changes
multiprocessor is the use of a multiprocessor two or more central processing units (CPUs) within a single computer system.
octo office of chief technology
overclocking is the process of making a computer or component operate faster than the overclock frequency specified by the manufacturer
PowerNow! is speed throttling Powernow! and power saving technology of AMD's processors used in laptops.
processor frequency Micro processor frequency specifies the operating (internal) frequency of CPU's core.
quad core processor for quadcore desktop PCs deliver greater performance for the most demanding multitasking environments.
S1 state All processor S1 caches are flushed, and the CPU(s) stops executing instructions
S2 state sleeping state S2
S3 state Commonly refer S3red to as Standby, Sleep, or Suspend to RAM
static RAM (SRAM) differentiates it from dynamic RAM (DRAM) which must be periodically refreshed. SRAM exhibits data remanence
stop errors A complete list of Windows STOP codes, often called Blue Screen stop error codes. STOP codes display
thermal compound also called thermal paste or thermal compound, is a substance used to promote better heat conduction between two surfaces
triple core A single chip with three distinct processors that work simultaneously
Created by: imtheman