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zs ch6
| Question | Answer |
|---|---|
| Advanced Configuration and Power Interface (ACPI) | the cureent set of standards that is used by BIOS hardware, and the OS to manage power |
| back-side bus (BSB) | connects the processor to the internal memory cache |
| case fan | fans which draw cool air through the system |
| Centrino | the intel processor chipset and wireless network adapter are all interconnected as a unit |
| chassis air guide (CAG) | air duct that helps to pull and direct fresh air from outside the case tothe cooler and processor. |
| Cool’n’Quiet | by amd lowers power requirements and helps keep a system quiet |
| Cooler | sits on top of the processor and consist of a fan and a heat sink |
| DRAM | RAM stored in memory modules |
| dual-core processing | supporting four instructions at once |
| Enhanced Intel SpeedStep Technology (EIST) | by intel steps down processor frequncy when the processor is idle to conserve power and lower heat |
| Execute disable bit | by intel is a security feature that prevents software from excuting or reproducing if it appears to be malicious. |
| front-side bus (FSB) | connects to the front side of the processor that faces the outside world. |
| heat sink | fins that draw heat away from the processor |
| hyper-threading | allow each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package |
| hyper transport | allow each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package |
| internal bus | insidde the processor housing, data, instructions, addresses, and control signals use the internal bus |
| Level 1 (L1) cache | memory on processor die |
| Level 2 (L2) cache | memory on processor package, but not on the processor die |
| Level 3 (L3) cache | father from processor core, but still in the processor package |
| liquid cooling system | a small pump sits inside the computer case, and tubes move water or other liquid around components and then away from them to a place where fans can cool the liquid |
| memory cache | RAM that holds data and instructions that the mmeory controller does anticipates the processor willneed next |
| MMX (Multimedia Extensions) | was the first technology to support repetitive looping whereby the processor recieves an instruction and then applies it to a stream of data that follows |
| multi-core processing | the processor housing contains two or more coresthat operate at the same frequency but independently of each other |
| multiplier | system bus frequency x multiplier = processor frequency |
| multiprocessor | installing more then one processor on a motherboard. |
| octo | supporting 16 instructions at once |
| overclocking | running a mother board or processor at a hiher speed then the manufacturer suggests |
| PowerNow! | by amd increases performance and lowers power requirements |
| processor frequency | is the speed at which the processor operates internally |
| quad core | supporting 8 instructions at once |
| S1 state | the hard drive andmonitor are turned off and everything elseruns normally |
| S2 state | the hard drive, monitor and processor are turned off called stand by or sleep mode |
| S3 state | evrything is shutdown except Ram and enough of the system to respond to a wake upcall such aspressing the keyboard |
| static RAM (SRAM) | memory in the momery cache |
| stop errors | usually cased by viruses |
| thermal compound | paste which serucres the heat sink to the processor |
| triple core | supporting 6 instructions at once |
Created by:
13zspiker
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