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TermDefinition
Advanced Configuration and Power Interface (ACPI) Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices.
back-side bus (BSB) The portion of a processor's internal bus that connects the processor to the internal memory cache. The bus operates at a much higher frequency than the front side bus.
case fan A fan inside a computer case used to draw air out or into the case.
Centrino A technology used by Intel whereby the processor, chipset, and wireless network adapter are all connected as a unit which improves laptop performance.
chassis air guide (CAG) A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor
Cool’n’Quiet A feature of AMD processors that lower power requirements and helps keep a system quiet.
Cooler A combination cooling fan and heat sink mounted on the top or side of the processor to keep it cool.
DRAM The most common type of system memory, it requires refreshing every few milliseconds.
dual-core processing A processor package that contains two core processors, thus supporting four instructions at once
Enhanced Intel SpeedStep Technology (EIST) A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat.
Execute disable bit A processor security feature by Intel that preserves software from executing or reproducing itself if it appears to be malicious
front-side bus (FSB) The bus between the CPU and memory on the motherboard. The bus frequency in documention is called the system speed, such as 400mhz. Also called the memory bus, front-side bus, local bus, or host bus.
heat sink A piece of metal, with cooling fans, that can be attached or mounted on an integrated chip to disparate heat.
hyper-threading The Intel technology that allows each logical processor within the processor package to handle an individual thread parallel with other threads being handled by other processors within the package
hyper transport The AMD technology that allows each logical processor within the processor package to handle an individual thread parallel with other threads being handled by other processors within the package
internal bus The bus inside the CPU that is used for communication between the CPU's internal components.
Level 1 (L1) cache Memory on the processor die used as a cache to improve processor performance.
Level 2 (L2) cache Memory inn the processor package, but not on the processor die. The memory is used as a cache or buffer to improve processor performance
Created by: pat20141720