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Advanced Configuration and Power Interface (ACPI) Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices
back-side bus (BSB) The portion of a processors internal bus that connects the processor to the internal memory cache. The bus operates at a much higher frequency than the front side bus.
case fan A fan inside a computer case used to draw air out of or into the case.
Centrino A technology used by Intel whereby the processor, chipset and wireless network adapter are all interconnected as a unit which improves laptop performance.
chassis air guide (CAG) A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor.
Cool’n’Quiet A feature of AMD processors that lowers power requirements and helps keep a system quiet.
Cooler A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool.
DRAM The most common type of system memory, it requires refreshing every few milliseconds.
dual-core processing A processor package that contains two core processors, thus supporting four instructions at once.
Enhanced Intel SpeedStep Technology (EIST) A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat.
Execute disable bit A processor secuity feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious.
front-side bus (FSB) The bus between the CPU and memory on the motherboard. The bus frequency in documentation is called the system speed,such as 400 MHz. AKA memory bus.
heat sink A piece of metal, with cooling fins, that can be attcahed to or mounted on an integrated chip (such as the CPU)to dissipate heat.
hyper-threading The intel technology that allows each logical processor within the processor package to handle and individual thread in parallel with other threads being handled by other processors within the package.
hyper transport The AMD technology that allows each logical processor within the processor package to handle and individual thread in parallel with other threads being handled by other processors within the package.
internal bus The bus inside the CPU that is used for communication between the CPU's internal components.
Level 1 (L1) cache Memory on the processor die used as a cache to improve processor performance.
Level 2 (L2) Memory in the processor package, but not on the processor die. The memory is used as a cache or buffer to improve processor performance.
Created by: antbartley18



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