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ch 6-stack1

Advanced Configuration and Power Interface (ACPI) specification developed by intel, compaq, phoenix, microsft, and toshiba to control power on computers and other devices
back-side bus (BSB) the portion of a proccessor's internal bus that connects the processor to the internal memory cache.
case fan a fan inside a computer case used to draw air out of or into the case.
Centrino a technology used by intel whereby the processor, chipset, and wireless network adapter are all interconnected as a unit which improves laptop performance. Centrino
chassis air guide (CAG) a round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor chassis air guide (CAG)
Cool’n’Quiet a feature of amd processors that lowers power requirements and helpkeep a system quiet.Cool’n’Quiet
Cooler a combination cooling fan and heat sink mounted on the top or side of the processor to keep it cool. Cooler
DRAM the most common type of sysetm memory, it requires refreshing every few milliseconds. DRAM
dual-core processing a processor package that contains to core processors,thus supporting four instruction at once. dual-core processing
Enhanced Intel SpeedStep Technology (EIST) a processor feature used by intel that steps down processor frequency when the processor is idle to conserve power and lower power. Enhanced Intel SpeedStep Technology (EIST)
Execute disable bit a processor security feature by intel that prevents software from executing or reproducing itself if it appers to be malicious.Execute disable bit
front-side bus (FSB) the bus between the cpu and the memory on the motherboard. front-side bus (FSB)
heat sink a piece of metal with cooling fins that can be attached to or mounted on an intergrated chipsuch as cpu to dissipate heat. heat sink
hyper-threading The Intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. hyper-threading
hyper transport The AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package.hyper transport
internal bus The bus inside the CPU that is used for communication between the CPU's internal components. internal bus
Level 1 (L1) cache Memory on the processor die used as a cache to improve processor. performance
Level 2 (L2) cache Memory in the processor package, but not on the processor die. The memory is use as a cache or buffer to improve processor performance. Level 2 (L2) cache
Created by: joseph0506