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nc-ch6-stack1

QuestionAnswer
Advanced Configuration and Power Interface (ACPI) an open industry specification co-developed by Hewlett-Packard, Intel, Microsoft, Phoenix, and Toshiba.
back-side bus (BSB) this bus operates at a much higher frequency than the front bus
case fan used to draw air out of or into the case
Centrino processor, chipset, and wireless adapter all interconnected as a unit to improve laptop performance
chassis air guide (CAG) helps pull and direct fresh air to the cooler and processor
Cool’n’Quiet lowers power requirements and helps keep a system quiet
Cooler combination cooling fan and heat sink on top of processor to keep cool
DRAM most common system memory,requires refreshing every few miliseconds dram
dual-core processing processor package that contains two core processors
Enhanced Intel SpeedStep Technology (EIST) steps down processor frequency when processor is idle to conserve power and lower that eist
Execute disable bit security feature that prevents reproduction or execution disable bit
front-side bus (FSB) bus between cpu and motherboard memory fsb
heat sink piece of metal with fans to dissipate heat sink
hyper-threading ability to handle individual thread parallel to other running threads hyper
hyper transport ability to handle individual thread parallel to other running threads transport
internal bus bus used for communication between cpu's internal components bus
Level 1 (L1) cache memory on the processor die l1
Level 2 (L2) cache memory in the process l2 package,but not on the processor die
Level 3 (L3) cache farther from the processor l3 core, but still in the processor package
Created by: natecorrea
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