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ng-st1-ch6 -Support

Chapter 6 - Support processors #1

QuestionAnswer
Advanced Configuration and Power Interface (ACPI) The current set of standards that is used by BIOS, hardware, and the OS to manage power. Advanced Configuration and Power Interface (ACPI)
back-side bus (BSB) The bus between the CPU and the L2 cache inside the CPU housing, back-side bus (BSB)
case fan Help to draw air into and out of the case. case fan
Centrino Intel's mobile processor technology. Using the Centrino technology, the Intel processor, chipset, and wireless network adapter are all interconnected as a unit, which improves laptop performance. Centrino
chassis air guide (CAG) Part of the case design. This air guide is a round air duct that helps to pull and direct fresh air from outside the case to the cooler and processor. chassis air guide (CAG)
Cool’n’Quiet AMD technology to lower power requirements and helps keep a system quiet. Cool’n’Quiet.
Cooler A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool. Cooler.
DRAM Memory modules (DIMMs) on the motherboard. DRAM.
dual-core processing Two processors contained in the same processor housing that share the interface with the chipset and memory. dual-core processing.
Enhanced Intel SpeedStep Technology (EIST) Intel's technology to put the processor in a sleep state when they are inactive and reduce voltage requirements and CPU frequency depending on the demands placed on the processor. Enhanced Intel SpeedStep Technology (EIST)
Execute disable bit An Intel security feature that prevents software from executing or reproducing itself if it appears to be malicious. Execute disable bit.
front-side bus (FSB) Another term for the system bus, front-side bus (FSB)
heat sink A piece of metal, with cooling fins, that can be attached to or mounted on an integrated chip (such as the CPU) to dissipate heat. heat sink
hyper-threading Intel's technology to allow each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package, hyper-threading
hyper transport AMD's technology to allow each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. hyper transport
internal bus The bus inside the CPU that is used for communication between the CPU's internal components. internal bus
Level 1 (L1) cache A type of internal cache (L1).
Level 2 (L2) cache A type of internal cache (L2).
Created by: 14ngallagher