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MB-Ch6-Stack 1

Advanced Configuration and Power Interface (ACPI) Specification developed by Intel, Comapq, Phoenix, Microsoft, and Toshiba to control power on computer and other devices.
back-side bus (BSB) The portion of a processor's internal bus that connects the processor to the internal memory cache. The bus operates at a much higher frequency than the front side bus.
case fan A fan inside a computer case used to draw air out of or into the case.
Centrino A technology used by Intel whereby the processor, chip set, and wireless network adapter are all interconnected as a unit which improves laptop performance.
chassis air guide (CAG) A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor.
Cool’n’Quiet A feature of AMD processors that lowers power requirements and helps keep a system quiet.
Cooler A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool.
DRAM The most common type of system memory, it requires refreshing every few milliseconds.
dual-core processing A processor package that contains two core processors, thus supporting four instructions at once.
Enhanced Intel SpeedStep Technology (EIST) A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower that.
Execute disable bit A processor security feature by Intel that prevents software from execution r reproducing itself if it appears to be malicious.
front-side bus (FSB) The bus between CPU and memory on the motherboard.
heat sink A piece of metal, with cooling fins, that can be attached or mounted on an integrated chip to dissipate heat.
hyper-threading The Intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package.
hyper transport The AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel wit other threads being hype package.
internal bus The bus inside the CPU that is used for communication between the CPU's internal components.
Level 1 (L1) cache Memory on the processor die used as a cache to improve processor performance.
Level 2 (L2) cache Memory in the processor package, but not on the processor die. The memory is used as a cache or buffer to improve processor performance.
Level 3 (L3) cache Cache memory further from the processor core than Level 2 cache, but still in the processor package.
Created by: 13mbugieda