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np-ch6-stack1

QuestionAnswer
Advanced Configuration and Power Interface (ACPI) Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices
back-side bus (BSB) The portion of the internal bus that connects the processor to the internal memory cache
case fan A fan inside a computer case used to draw air out of or into the case
Centrino A technology used by Intel whereby the processor, chipset, and wireless network adapter are all interconnected as a unit which improves laptop performance
chassis air guide (CAG) A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor
Cool’n’Quiet A feature of AMD processors that lowers power requirements and helps keep a system quiet
Cooler A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool
DRAM The most common type of system memory, it requires refreshing every few milliseconds.
dual-core processing A processor package that contains two processors, thus supporting four instructions at once
Enhanced Intel SpeedStep Technology (EIST) A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat
Execute disable bit A processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious
front-side bus (FSB) The bus between the CPU and memory on the motherboard.
heat sink A piece of metal,with cooling fins, that can be attached to or mounted on an integrated chip to dissipate heat.
hyper-threading The intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package
hyper transport The AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package
internal bus The bus inside the CPU that is used for communication between the CPU's internal components
Level 1 (L1) cache Memory on the processor die used as a cache to improve processor performance.
Level 2 (L2) cache Memory in the processor package, but not on the processor die
Created by: npelbano