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np-ch6-stack1
Question | Answer |
---|---|
Advanced Configuration and Power Interface (ACPI) | Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices |
back-side bus (BSB) | The portion of the internal bus that connects the processor to the internal memory cache |
case fan | A fan inside a computer case used to draw air out of or into the case |
Centrino | A technology used by Intel whereby the processor, chipset, and wireless network adapter are all interconnected as a unit which improves laptop performance |
chassis air guide (CAG) | A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor |
Cool’n’Quiet | A feature of AMD processors that lowers power requirements and helps keep a system quiet |
Cooler | A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool |
DRAM | The most common type of system memory, it requires refreshing every few milliseconds. |
dual-core processing | A processor package that contains two processors, thus supporting four instructions at once |
Enhanced Intel SpeedStep Technology (EIST) | A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat |
Execute disable bit | A processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious |
front-side bus (FSB) | The bus between the CPU and memory on the motherboard. |
heat sink | A piece of metal,with cooling fins, that can be attached to or mounted on an integrated chip to dissipate heat. |
hyper-threading | The intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package |
hyper transport | The AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package |
internal bus | The bus inside the CPU that is used for communication between the CPU's internal components |
Level 1 (L1) cache | Memory on the processor die used as a cache to improve processor performance. |
Level 2 (L2) cache | Memory in the processor package, but not on the processor die |