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Question | Answer |
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Advanced Configuration and Power Interface (ACPI) | Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices |
back-side bus (BSB) | The portion of a processor's internal bus that connects the processor to the internal memory cache. The bus operates at a much higher frequency than the front side bus. |
case fan | Fan inside a computer case used to draw air out of or into the case. |
Centrino | A technology used by Intel whereby the processor, chipset, and wireless network adapter are all interconnected as a unit which improves laptop performance |
chassis air guide (CAG) | Round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor. |
Cool’n’Quiet | Feature of AMD processors that lower power requirements and helps keep a system quiet. |
Cooler | Combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool. |
DRAM (dynamic RAM) | Most common type of system memory, it requires refreshing every few milliseconds. |
dual-core processing | Processor package that contains two core processors, supporting four instructions at once. |
Enhanced Intel SpeedStep Technology (EIST) | Processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat. |
Execute disable bit | Processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious. |
front-side bus (FSB) | Bus between the CPU and memory on the motherboard. The bus frequency in documentation is called the system speed, such as 400 MHz. Also called the Memory bus, front-side bus, local bus, or host bus. |
heat sink | Piece of metal, with cooling fins, that can be attached to or mounted on an intergrated chip (such as the CPU) to dissipate heat. |
hyper-threading | Intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. |
hyper transport | AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. |
internal bus | Bus inside the CPU that is used for communication between the CPU's internal components. |
Level 1 (L1) cache | Memory on the processor die used as a cache to improve processor performance. |
Level 2 (L2) cache | Memory in the processor package, but not on the processor die. The memory is used as a cache or buffer to improve processor performance. |