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QuestionAnswer
Advanced Configuration and Power Interface (ACPI) Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices.
back-side bus (BSB) The portion of a processor's internal bus that connects the processor to the internal memory cache. The bus operates at a much higher frequency than the front side bus.
case fan A fan inside a computer case used to draw air out of or into the case.
Centrino A technology used by Intel whereby the processor, chip set, and wireless network adapter are all interconnected as a unit which improves laptop performance.
chassis air guide (CAG) A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor.
Cool’n’Quiet A feature of AMD processors that lowers power requirements and helps keep a system quiet.
Cooler A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool.
DRAM See dynamic RAM (DRAM). The most common type of system memory, it requires refreshing every few milliseconds.
dual-core processing A processor package that contains two core processors, thus supporting four instructions at once.
Enhanced Intel SpeedStep Technology (EIST) A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat.
Execute disable bit A processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious.
front-side bus (FSB) bus that connects to the front side of the processor that faces the outside world
heat sink A piece of metal, with cooling fins, that can be attached to or mounted on an integrated chip (such as the CPU) to dissipate heat.
hyper-threading The Intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package.
hyper transport The AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package.
internal bus The bus inside the CPU that is used for communication between the CPU's internal components.
Level 1 (L1) cache Memory on the processor die used as a cache to improve processor performance.
Level 2 (L2) cache Memory in the processor package, but not on the processor die. The memory is used as a cache or buffer to improve processor performance. Also see Level 1 (L1) cache.
Level 3 (L3) cache Cache memory further from the processor core than Level 2 cache, but still in the processor package.
liquid cooling system A method to cool overclocked processors that uses a small pump inside the computer case and tubes that move water or other liquid around components and then away from them to a place where fans can cool the liquid.
memory cache A small amount of faster RAM that stores recently retrieved data, in anticipation of what the CPU will request next, thus speeding up access.
MMX (Multimedia Extensions) Multimedia instructions built into Intel processors to add functionality such as better processing of multimedia, SIMD support, and increased cache.
multi-core processing A processor technology whereby the processor housing contains two or more processor cores that operate at the same frequency, but independently of each other.
multiplier The factor by which the bus speed or frequency is multiplied to get the CPU clock speed.
multiprocessor A system that contains more than one processor. The motherboard has more than one processor socket and the processors must be rated to work in this multi-processor environment.
octo A processor package that contains eight cores and supports 16 instructions at once.
overclocking Running a motherboard or processor at a higher speed then the manufacturer.
PowerNow! An AMD technology that increases performance and lowers power requirements for processors.
processor frequency The frequency at which the CPU operates. Usually expressed in GHz.
quad core A processor package that contains four cores and supports eight instructions at once.
S1 state The ACPI power saving mode where the hard drive and monitor are turned off and everything else runs normally.
S2 state The ACPI power saving mode where the hard drive, monitor, and processor are turned off.
S3 state The ACPI power saving mode where everything is shut down except RAM and enough of the system to respond to a wake-up call such as pressing the keyboard. Also called sleep mode or standby mode.
static RAM (SRAM) RAM chips that retain information without the need for refreshing, as long as the computer's power is on. They are more expensive than traditional DRAM.
stop errors An error at the kernel level that is severe enough to cause the operating system to stop all processes.
thermal compound A cream like substance that is placed between the bottom of the cooler heat sink and the top of the processor to eliminate air pockets and to help to draw heat off the processor.
triple core A processor package that contains three core processors, thus supporting six instructions at once.
Created by: danyc94