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Level 1 Cache Memory on the processor die
Level 2 Cache Memory in the processor package but not in the die
Level 3 Cache Memory in the third Cache that is farther from the processor core but still in the processor package
Hyper-Threading Intels best technologies for processors
Hyper Transport AMDS Best technologies for processors
Front Side bus Data portion of the external bus
Internal bus The data portion of that bus called the internal data bus is 32 bits wide.
Back-Side Bus The processors internal bus operates at a memory cache
Processor frequency is the speed at which the processor operates internally
Multiplier If the processor operates at 3.2 GHz internally but 800MHz externally the processor frequency is 3.2 GHz and the system bus frequency is 800 MHz
overclock Running a motherboard or processor at a higher speed than the manufacturer suggest
multiprocessor platforms Installing more than one processor on a motherboard
multi-core processing The processor housing contains two or more cores that operate at the same frequency but independently of each other
dual-core processing A cpu using two cores and supporting 4 instructions at once
triple core a Cpu using three cores while supporting six instructions at once
quad core a cpu using four cores while supporting eight instructions at once
octo core a cpu using eight cores while supporting sixteen instructions at once
chassis air guide (CAG) A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor
Cool’n’Quiet A feature of AMD processors that lowers power requirements and helps keep a system quiet.
Cooler A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool.
case fan A fan inside a computer case used to draw air out of or into the case.
Centrino A technology used by Intel whereby the processor, chipset, and wireless network adapter are all interconnected as a unit which improves laptop performance.
Advanced Configuration and Power Interface (ACPI) Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices.
DRAM The most common type of system memory, it requires refreshing every few milliseconds.
Enhanced Intel SpeedStep Technology (EIST) A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat.
Execute disable bit A processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious.
Heat Sink A piece of metal, with cooling fins, that can be attached to or mounted on an integrated chip (such as the CPU) to dissipate heat.
liquid cooling system A method to cool overclocked processors that uses a small pump inside the computer case and tubes that move water or other liquid around components and then away from them to a place where fans can cool the liquid.
memory cache A small amount of faster RAM that stores recently retrieved data, in anticipation of what the CPU will request next, thus speeding up access.
MMX (Multimedia Extensions) Multimedia instructions built into Intel processors to add functionality such as better processing of multimedia, SIMD support, and increased cache.
PowerNow! An AMD technology that increases performance and lowers power requirements for processors.
S1 state The ACPI power saving mode where the hard drive and monitor are turned off and everything else runs normally.
S2 state The ACPI power saving mode where the hard drive, monitor, and processor are turned off.
S3 state The ACPI power saving mode where everything is shut down except RAM and enough of the system to respond to a wake-up call such as pressing the keyboard. Also called sleep mode or standby mode.
static RAM (SRAM) SRAM See static RAM. RAM chips that retain information without the need for refreshing, as long as the computer's power is on. They are more expensive than traditional DRAM.
stop errors An error at the kernel level that is severe enough to cause the operating system to stop all processes.
thermal compound A creamlike substance that is placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets and to help to draw heat off the processor.
Created by: chrischan