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bm ch6 stack 1
| Question | Answer |
|---|---|
| Level 1 cache | Memory on the processor die. |
| Level 2 cache | Memory in the processor package, but not on the processor die. |
| Level 3 cache | Farther from the processor core but still in the processor package. |
| Hyper-Threading | Best known technologies used by intel. |
| Hyper-Transport | Best known technologies used by AMD. |
| Front side bus | Connects to the front side of the processor that faces the outside world. |
| Internal bus | Bus that is inside. |
| Back-side bus | Bus on the back. |
| Processor frequency | Speed in which the processor operates internally. |
| Multiplier | When the bus frequency is multiplied. |
| Overclocking | Running at a higher speed the recommended. |
| Multiprocessor | More than one processor. |
| Multi-core processing | Latest advancement in multiple processing. |
| Dual-core processing | Supporting four instructions at once. |
| Triple core | Supporting six instructions at once. |
| Octo core | Supporting sixteen instructions at once. |
| Quad core | Supporting eight instructions at once. |
| Memory cache | RAM that holds data and instructions that the memory controller anticipates the processor will need next. |
| DRAM | Looses data rapidly and must be refreshed frequently. |
| Static RAM | Can hold its data as long as power is available. |
| MMX | First technology to support repetitive looping and is also called multimedia extensions. |
| PowerNow! | Increases performance and lowers power requirements. |
| Cool'n'Quiet | Lowers power requirements and helps keep the system quiet. |
| EIST | Enhanced intel speedstep technology. |
| Execute disable bit | Security feature that prevents software from executing. |
| Centrino | Included in intel mobile processors. |
| Cooler | Sits on top of the processor and has a fan and heat sink. |
| Heat sink | Disperses heat and has a fan on top of it. |
| Thermal compound | Placed between the bottom of the cooler heat sink and the top of the processor. |
| Case fan | Helps draw air out of the case. |
| Liquid cooling system | Uses tubes of water to cool the system. |
| ACPI | Advanced configuration and power interface. |
| S1 state | Hard drive and monitor are turned off and everything else runs normally. |
| S2 state | Monitor, hard drive, and processor are turned off. |
| S3 state | Everything is shut down except RAM. |