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Level 1 Cache Memory on the processor die.
Level 2 Cache Memory in the processor package.
Level 3 Cache Cache memory further from the processor core than level 2, butt still in the processor package.
Hyper-Threading The Intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package.
Hyper Transport The AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package.
Front-Side Bus (FSB) The bus between the CPU and memory on the motherboard.
Internal Bus The bus inside the CPU that is used for communication between the CPU's internal components.
Back-Side Bus (BSB) The portion of a processor's internal bus that connects the processor to the internal memory cache.
Processor Frequency The frequency at which the CPU operates.
Multiplier The factor by which the bus speed is multiplied to get the CPU clock speed.
Overclocking Running a processor at a higher frequency than is recommended.
Multiprocessor Platform A system that contains more than one processor.
Multi-Core Processing A processor technology whereby the processor housing contains two or more processor cores that operate at the same frequency.
Dual Core A processor package that contains two core processors.
Triple Core A processor package that contains three core processors, thus supporting six instructions at once.
Quad Core A processor package that contains four cores and supports eight instructions at once.
Octo Core A processor package that contains eight cores and supports 16 instructions at once.
Memory cache A small amount of faster RAM that stores recently retrieved data, in anticipation of what the CPU will request next, thus speeding up access.
dynamic RAM The most common type of system memory.
Static RAM RAM chips that retain information without the need for refreshing, as long as the computer's power is on.
PowerNow! An AMD technology that increases performance and lowers power requirements for processors.
MMX The first technology to support repetitive looping.
Cool'n'Quiet A feature of AMD processors that lower power requirements and helps keep a system quiet.
EIST A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat.
Execute Disable Bit A processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious.
Centrino A technology used by Intel whereby the processor, chip set, and wireless network adapter are all interconnected as a unit which improves laptop performance.
Cooler A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool.
Heat Sink A piece of metal, with cooling fins, that can be attached to or mounted on an integrated chip to dissipate heat.
Thermal Compound A creamlike substance used to eliminate air pockets and to help to draw heat off the processor.
Case Fan A fan inside a computer case used to draw air out of or into a case.
Liquid Cooling System A method to cool overclocking processors.
ACPI
S1 State The ACPI power saving mode where the hard drive and monitor are turned off and everything else runs normally.
S2 State The ACPI power saving mode where the hard drive, monitor, and processor are turned off.
S3 State The ACPI power saving mode where everything is shut down except RAM.
S4 State The ACPI power saving mode where everything in RAM is copied to a file on the hard drive and the system is shut down.
Chassis Air Guide A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor.
Created by: genohelm
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