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mg ch6 stack1

QuestionAnswer
Level 1 cache memory on the processor die
Level 2 cache memory in the processor package
Level 3 cache memory further from the processor core, but still in the processor package
Hyper-Threading Intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package
HyperTransport allow each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by processors within the package
front-side bus connects to the front side of the processor that faces the outside world
internal bus the bus inside the CPU that is used for communication between the CPU's internal components
back-side bus portion of the internal bus that connects the processor to the internal memory cache
Processor frequency speed at which the processor operates internally
multiplier the factor by which the bus speed or frequency is multiplied to get the CPU clock speed
overclocking running a motherboard or processor at a higher speed than the manufacturer
multiprocessor platform a second method of improving performance is installing more than one processor on a motherboard
multi-core processing latest advancement in multiple processing
dual core two cores
triple core three cores
quad core four cores
octo core eight cores
memory cache L1, L2, or L3 cache
static RAM S-RAM
MMX multimedia extensions
PowerNow! AMD increases performance and lowers power requirements
Cool'n'Quiet AMD lowers power requirements and helps keep a system quiet
Enhanced Intel SpeedStep Technology Intel steps down processor frequency when the processor is idle to conserve power and lower heat
Execute Disable Bit security feature that prevents software from executing or reproducing itself if it appears to be malicious
Centrino Intel processor, chipset, and wireless network adapter are all interconnected as a unit
cooler consists of a fan
heat sink fins that draw heat away from the processor
thermal compound placed between the bottom of the cooler heatsink and the top of the processor
case fan one or more positions of hold a case fan
DRAM dynamic RAM
liquid cooling system small pump sits inside the computer case, and tubes move water or other liquid around components and then away from them to a place where fans can cool the liquid
Advanced Configuration and Power Interface current set of standards that is used by BIOS, hardware, and the OS to manage power
S1 state hard drive and monitor are turned off and everything else runs normally
S2 state hard drive, monitor, and processor are turned off
S3 state everything is shut down except RAM and enough of the system to respond to a wake-up call
chassis air guide air guide is a round air duct
stop errors unknown error message on a blue background is displayed and system halts
Created by: mgentner