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ch6 stack 1
| Question | Answer |
|---|---|
| Level 1 cache | Memory on the processor die |
| Level 2 cache | Memory in the processor package, but not on the processor die. |
| level 3 cache | Some processor use a thrid cache farther from the processor core, but still in the processor package |
| Advanced Configuration and Power Interface (ACPI) | the current set of standards that is used by bios, hardware and the OS to manage power |
| back-side bus (BSB) | the processor internal |
| case fan | fan inside a computer case used to draw air out of or into the case |
| Centrino | technology used by Intel whereby the processor, chipset,and wireless network adapter are all interconnected as a unit which improves laptop performance |
| chassis air guide (CAG) | intel and AMD recommend a CAG as a case design the portion of bus that connects the processor to the internal memory cache |
| Cool’n’Quiet | By AMD lowers power requirement and helps keeps the system quiet |
| Cooler | sists on top of the processor and consists of a fan |
| DRAM | see dynamic ram (dram)running the processor at a higher frequency then is recommended |
| dual-core processing | supporting four instruction |
| Enhanced Intel SpeedStep Technology (EIST) | by Intel steps down processor frequency when the processor is idle to conserve power and lower heat. |
| Execute disable bit | By intel is a security feature that prevents software from executing or reproducing itself if it appears to be malicious |
| front-side bus (FSB) | it connects to the front side of the processor that faces the outside world. |
| heat sink | which are fins that draw heat away from the processor |
| hyper-threading | Probably the best known technologies used by processor are intel |
| hyper transport | Probably the best known technologies used by processor are intel and amd |
| internal bus | Inside the processor housing, data, instruction,addresses, and control signals |
| liquid cooling system | the most popular method of cooling overclocked processor |
| memory cache | such as an L1,L2,or L3 cache, is RAm that holds data and instruction the memory controller anticipates the processor will need next |
| MMX (Multimedia Extensions) | the first technology to support repetitive looping, whereby the processor receives an instruction and then applies to it to a stream of data that follows |
| multi-core processing | latest advancement in multiple processing is multi core processing |
| multiplier | if you multiply the system bus frequency by the multiplier, you get the processor frequency |
| multiprocessor | A second method of improving performance is installing more than one processor on a motherboard |
| octo | supporting sixteen instruction at once |
| PowerNow! | by AMD increase performance and lowers power requirement |
| processor frequency | is the speed at which the processor operate internally |
| quad core | supporting eight instruction at once |
| S1 state | the hard drive and monitor are turned off and everything else runs normally. |
| S2 state | the hard drive, monitor, and processor, are turned off |
| S3 state | everything is shut down ecxept RAM and enough of the system to respond to a wake up call such as pressing the keyboard or moving the mouse |
| static RAM (SRAM) | it does not need refreshing and can hold data as long as power is available |
| stop errors | an error at the kernel level that is severe enough to cause the operating system to stop all processes |
| thermal compound | is placed between the bottom of the cooler heatsink and the top of the processor |
| triple core | supporting six instruction at onc |
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apius
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