Help
Options
Didn't know it?
click below
click below
Knew it?
click below
click below
Don't Know
Remaining cards (0)
Know
retry
shuffle
restart
0:00
Embed Code - If you would like this activity on your web page, copy the script below and paste it into your web page.
Normal Size Small Size show me how
Normal Size Small Size show me how
Dm Chp 6
| Question | Answer |
|---|---|
| Level 1 cache | Memory on the processor die. |
| Level 2 cache | Memory in the processor package. |
| Level 3 cache | farthest from the processor core. |
| Hyper-Threading | The Intel technology that allows each logical processor package to handle an indivdual thread in parallel with other threads being handled by other processors within the package. |
| HyperTransport | The AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. |
| Front-side bus | The bus is said to be an external bus because its external to the processor. |
| internal bus | The bus inside the CPU that is used for communications between the CPU's internal components. |
| Back-side bus (BSB) | The portion of the internal bus that connects the processor to the internal memory cache. |
| processor frequency | is the speed at which processor operates internally. |
| overclocking | Running a motherboard or processor at a higher speed than the manufacturer suggests. |
| Advanced Configuration and Power Interface (ACPI) | Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices. |
| case fan | A fan inside the computer case used to draw air out or into the case. |
| Centrino | A technology used by Intel whereby the processor, chipset and wireless network adapter are all interconnected as a unit which improves laptop performance. |
| chassis air guide (CAG) | A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor. |
| Cool’n’Quiet | A feature of AMD processors that lowers power requirements and helps keep a system quiet. |
| Cooler | A combined cooling fan and heat sink mounted on the top or side of a processor to keep it cool. |
| DRAM | performance also improves because RAM stored in memory modules on the motherboard. |
| dual-core processing | A processor package that contains two core processors, thus supporting for instructions at once. |
| Enhanced Intel SpeedStep Technology (EIST) | A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat. |
| Execute disable bit | A processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious. |
| front-side bus (FSB) | connects to the front side of the processor that faces the outside world. |
| heat sink | a piece of metal, with cooling fans, that can be attached to or mounted on an integrated chip to dissipate heat. |
| liquid cooling system | A method to cool overclocking processors that uses a small pump inside the computer case and tubes that move water or liquid, around components and then away from them to a piece where fans can cool the liquid. |
| memory cache | A small amount of Faster RAM that stores recently retrieve data, in anticipation of what the CPU will request next, thus speeding up access. |
| MMX (Multimedia Extensions) | Multimedia instructions built into Intel processors to add functionality such as better processing of multimedia, SIMD support,and increased cache. |
| multi-core processing | The processor housing contains two or more processor cores that operate at the same frequency, but independently of each other. |
| multiplier | The factor by which the bus speed or frequency is multiplied to get the CPU clock speed. |
| multiprocessor | A system that contains more than one processor. |
| octo | A processor package that contains eight cores and supports 16 instructions at once. |
| PowerNow! | An AMD technology that increases performance and lowers power requirements for processors. |
| quad core | A processor package that contains four cores and supports eight instructions at once. |
| S1 state | The ACPI power saving mode where the hard drive and monitor are turned off and everything else runs normally. |
| S2 state | The ACPI power saving mode where the hard drive,monitor, and processor are turnned off. |
| S3 state | The ACPI power saving mode where everything is shut down except RAM and enough of the system to respond to a wake-up call such as pressing the keybored. |
| static RAM (SRAM) | RAM chips that retain information without the need for refreshing, as long as the computers power is on. They are more expensive than traditional DRAM. |
| stop errors | An error at the kernel level that is severe enough to cause the operating system to stop all processes. |
| thermal compound | A creamlike substance that is placed placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets and to help to draw heat off the processor. |
| triple core | A processor package that contains three core processors, thus supporting six instructions at once. |
Created by:
DomMarsico
Popular Computers sets