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Term | Definition |
---|---|
Advanced Configuration and Power Interface (ACPI) | The current set of standards that is used by BIOS, hardware, and the OS to manage power. |
back-side bus (BSB) | The portion of the internal bus that connects the processor to the internal memory cache. |
case fan | A fan inside a computer case used to draw air out of or into the case. |
Centrino | A technology used by Intel whereby the processor, chipset, and wireless network adapter are all interconnected as a unit which improves laptop performance. |
chassis air guide (CAG) | A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor. |
Cool’n’Quiet | A feature of AMD processors that lowers power requirements and helps keep a system quiet. |
Cooler | A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool. |
DRAM | The most common type of system memory, it requires refreshing every few milliseconds. |
dual core | A processor package that contains two core processors, thus supporting four instructions at once. |
Enhanced Intel SpeedStep Technology (EIST) | A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat. |
Execute disable bit | A processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious. |
front-side bus (FSB) | The bus between the CPU and memory on the motherboard. |
heat sink | A piece of metal, with cooling fins, that can be attached to or mounted on an integrated chip (Such as the CPU) to dissipate heat. |
hyper-threading | The Intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. |
hyper transport | AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. |
internal bus | The bus inside the CPU that is used for communication between the CPU's internal components. |
Level 1 (L1) cache | Memory on the processor die. |
Level 2 (L2) cache | Memory in the processor package, but not on the processor die. |
Level 3 (L3) cache | Cache memory further from the processor core than Level 2 cache, but still in the processor package. |
liquid cooling system | A method to cool overclocked processors that uses a small pump inside the computer case and tubes that move water or other liquid around components and then away from them to a place where fans can cool the liquid. |
memory cache | RAM that holds data and instructions from the memory controller anticipates the processor will need next. |
MMX (Multimedia Extensions) | The first technology to support repetitive looping, whereby the processor receives an instruction and then applies it to a stream of data that follows. Prior to MMX, each data set had to be preceded by an instruction to process it. |
multi-core processing | A processor technology whereby the processor housing contains two or more processor cores that operate at the same frequency, but independently of each other. |
multiplier | The factor by which the bus speed or frequency is multiplied to get the CPU clock speed. |
multiprocessor | A system that contains more than one processor. The motherboard has more than one processor socket and the processors must be rated to work in this multi-processor environment. |
octo | A processor package that contains eight cores and supports 16 instructions at once. |
overclocking | Running a motherboard or processor at a higher speed than the manufacturer suggests. |
PowerNow! | An AMD technology that increases performance and lowers power requirements for processors |
processor frequency | The frequency at which the CPU operates. Usually expressed in GHz. |
quad core | A processor package that contains four cores and supports eight instructions at once. |
S1 state | The ACPI power saving mode where the hard drive and monitor are turned off and everything else runs normally. |
S2 state | The ACPI power saving mode where the hard drive, monitor, and processor are turned off. |
S3 state | The ACPI power saving mode where everything is shut down except RAM and enough of the system to respond to a wake-up call such as pressing the keyboard. Also called standby or sleep mode |
static RAM (SRAM) | RAM chips that retain information without the need for refreshing, as long as the computer's power is on. They are more expensive than traditional DRAM. |
stop errors | An error at the kernel level that is severe enough to cause the operating system to stop all processes. |
thermal compound | A creamlike substance that is placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets and to help draw heat off the processor. |
triple core | A processor package that contains three core processors, thus supporting six instructions at once. |