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TermDefinition
Advanced Configuration and Power Interface (ACPI) specification developed by Intel, Compaq, Pheonix, Microsoft, and Toshiba to control power on computers
back-side bus (BSB) the portion of the internal bus that connects the processor to the internal memory cache
case fan a fan inside a computer case used to draw air out of or into the case
Centrino using Centrino, the Intel processor, chipset, and wireless network adapter are all interconnected as a unit centrino
chassis air guide (CAG) a round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor cag
Cool’n’Quiet AMD lowers power requirements and helps keep a system quiet coolnquiet
Cooler a combination cooling fan and heat sink mounted on the top or side of a processor cooler
DRAM (dynamic RAM) performance also improves because RAM is stored in memory modules dram
dual-core processing supporting 4 instructions at once 2core pro
Enhanced Intel SpeedStep Technology (EIST) a processor feature used by Intel that steps down processor frequency eist
Execute disable bit a security feature that prevents software from executing or reproducing itself if it appears to be malicious edb
front-side bus (FSB) connects to the front side of the processor that faces the outside world. fsb
heat sink a piece of metal, with cooling fins, that can be attached or mounted to an integrated chip
hyper-threading hyper threading allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package (threading)
hyper transport hyper transport allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package (transport)
internal bus the AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads internal bus
Level 1 (L1) cache memory on the processor die L1
Level 2 (L2) cache memory in the processor package, but not on the processor die L2
Level 3 (L3) cache a processor cache farther from the processor core, but still in the processor package L3
liquid cooling system a method to cool overclocked processors liquid
memory cache RAM that holds data and instructions that the memory controller anticipates the processor will need next mem cache
MMX (Multimedia Extensions) 1st technology to support repetitive looping, whereby the processor receives an instruction and then applies to a stream of data that follows mmx
multi-core processing using this technology, the processor housing contains 2 or more cores that operate at the same frequency mc pro
multiplier the processor operates at four times the speed multiplier
multiprocessor installing more than one processor on a motherboard
octo core supports 16 instructions at once octocore
overclocking running a motherboard or processor at a higher speed than the manufacturer suggests overclocking
PowerNow! AMD increases performance and lowers power requirements powernow
processor frequency the speed at which the processor operates internally frequency
quad core supports 8 instructions at once quad
S1 state the ACPI power saving mode where the hard drive and monitor are turned off and everything else runs normally s1
S2 state the ACPI power saving mode where the hard drive, monitor, and processor are turned off s2
S3 state the ACPI power saving mode where everything except the RAM is shut down s3
static RAM (SRAM) memory in a memory cache sram
stop errors an error at the kernel level that is severe enough to cause the operating system to stop all processes stop errors
thermal compound a creamlike substance that is placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets thermal compound
triple core supports 6 instructions at once triple core
Created by: ChrisxPirrone