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DS Chapter 6 Stack 1
Term | Definition |
---|---|
Advanced Configuration and Power Interface (ACPI) | Controls power on computers and other devices. |
back-side bus (BSB) | internal bus that connects the processor to the internal memory cache. |
case fan | a fan inside a computer case used to draw air out of or into the case. |
Centrino | intel processor, chipset, and wireless network adapter are all interconnected as a unit, which improves laptop performance. |
chassis air guide (CAG) | a round duct that helps to pull and direct fresh air from outside the case to the cooler and processor. |
Cool’n’Quiet | lowers power requirements and help keeps a system quiet. |
Cooler | sits on top of the processor and consist of a fan. |
DRAM | The most common type of system memory,D it requires refreshing every few milliseconds. |
dual-core processing | A processor package that contains two core processors,dual thus supporting four instructions at once. |
Enhanced Intel SpeedStep Technology (EIST) | steps down processor frequency when the processor is idle to conserve power and lower heat.EIST |
Execute disable bit | by Intel, is a security feature that prevents software from executing or reproducing itself if it appears to be EDB malicious. |
front-side bus (FSB) | The bus between the CPU and memory on the motherboard. The bus frequency in documentation is called the system speed, such as 400 MHz. Also called the memory bus, front-side bus, local bus, or host bus. |
heat sink | A piece of metal, with cooling fins, that can be attached to or mounted on an integrated chip (such as the CPU) to dissipate heat. |
hyper-threading | The Intel technology th. |
hyper transport | The AMD technology tr. |
internal bus | The bus inside the CPU that is used for communication between internal the CPU's internal components |
Level 1 (L1) cache | Memory on the L1 processor die. |
Level 2 (L2) cache | Memory in the L2 processor package, but not on the processor die. |
Level 3 (L3) cache | Some processors use a third cache farther from the processor core, but still in the processor package. |
liquid cooling system | A method to cool overclocked processors that uses a small pump inside the computer case and tubes that move water or other liquid around components and then away from them to a place where fans can cool the liquid. |
memory cache | RAM that holds memory data and instructions that the memory controller anticipates the processor will need next. |
MMX (Multimedia Extensions) | the first multi technology to support repetitive looping. |
multi-core processing | the processor multi housing contains two or more processing cores that operate at the same frequency, but independently of each other. |
multiplier | The factor by which the bus speed or frequency is multiplied to get the CPU clock speed. |
multiprocessor | A system that contains more than one processor. The motherboard has more than one processor socket and the processors must be rated to work in this multi-processor environment. |
octo | A processor package that contains eight cores and supports 16 instructions at once. |
overclocking | Running a processor at a higher frequency than is recommended by the manufacturer, which can result in an unstable system, but is a popular thing to do when a computer is used for over gaming. |
PowerNow! | increases performance and lowers power requirements. |
processor frequency | The frequency at which the CPU operates. Usually expressed in GHz. |
quad core | A processor package that contains four cores and supports eight instructions at once. |
S1 state | the hard drive and S1 monitor are turned off and everything else runs normally. |
S2 state | the hard drive, monitor, s2and processor are turned off. |
S3 state | everythings3 is shut down except for RAM. |
static RAM (SRAM) | SRAM chips that retain information without the need for refreshing, as long as the computers power is on. |
stop errors | An error at the kernel level that is severe enough to cause the operating system to stop all processes. |
thermal compound | placed thermal between the bottom of the cooler heat sink and the top of the processor. |
triple core | A processor package that contains three core processors, thus supporting six instructions at once. |