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IPC-A-610
| Question | Answer |
|---|---|
| Class 1 Product | General Electronics Product-includes products where the major requirement is function of the completed assembly. |
| Class 2 Product | Dedicated Service Electronic Product-continued performance and extended life required. Uninterrupted service is desired but not required. |
| Class 3 Product | High Performance Electrical Product-continued high performance or performance-on-demand is critical. Equipment downtime cannot be tolerated. Equipment might be used for life support or other critical systems. |
| Who has the ultimate responsibility for identifying the class to which the assembly is evaluated? | The customer |
| Shall | Invokes a requirement for manufacturers of all classes or product, and failure to comply with the requirement is a noncompliance to this standard. |
| Order of Precedence in the event of conflict 1) | Procurement as agreed and documented between customer and supplier. |
| Order of Precedence in the event of conflict 2) | Master drawing or master ass. drawing reflecting the customer's detailed requirements. |
| Order of Precedence in the event of conflict 3) | IPC-A-610 when invoked by the customer or contract. |
| If documents other than IPC-A-610 are cited, the order of precedence shall be defined in the_____ | Procurement Documents |
| Target condition | A condition that is close to perfect, but is not always achievable and may not be necessary to ensure the reliability of the assembly. |
| Acceptable condition | A condition that, while not necessarily perfect, will maintain integrity and reliability of the assembly. |
| Defect condition | The form, fit or function of the assembly is inadequate for use in its end use environment. |
| A defect for Class 1_________ | automatically implies a defect for Class 2 and Class 3. A defect for Class 2 implies a defect for Class 3. |
| Disposition | The determination of how defects should be treated. These include, rework, use as is, scrap, or repair. |
| Who dispositions defect conditions? | The manufacturer, based on design, service and customer requirements. |
| Process Indicator Conditions | A condition (not a defect) that does not affect the form, fit or function of a product. |
| Process Indicators should be_____ | monitored as part of the process control system. |
| Is disposition of individual process indicators required? | Conditions Not Specified |
| Primary Side | The side of a packaging or interconnecting structure (PCB) defined as primary on the master drawing. This is usually the side with the most complex or greatest number of components. |
| The Primary Side is also known as ______ | the component side, or the solder destination side (in through hole mounting technology). |
| Solder Source Side | The side of the PCB to which solder is applied. This is usually the secondary side, but might be the primary side in some cases. |
| Solder Destination Side | The side of the PCB that the solder flows toward in through hole technology. The destination is normally the primary side of the PCB, but might be secondary side in some cases. |
| Cold Solder Connection | A solder connection that exhibits poor wetting and that is characterized by a gray, porous appearance. |
| What can cause a cold solder connection? | Excessive impurities in the solder, inadequate cleaning prior to the soldering, and/or insufficient application of heat during the soldering process. |
| Any violation of minimum electrical clearance is _____ | defect condition for all classes. |
| Meniscus (component) | Sealant or encapsulant on a lead, protruding from the seating plane of the component. This includes ceramic, epoxy or other composites, and flash from molded components. |
| Nonfunctional Land | A land that is not connected electrically to the conductive pattern on its layer. |
| Wire OverWRAP | A wire/lead that is wrapped more than 360 degrees and remains in contact with the terminal post. |
| Wire OverLAP | A wire/lead is wrapped more than 360 degrees and crosses over itself (and does not remain in contact with the terminal post). |
| Examples and illustrations... | are often grossly exaggerated in order to depict the reasons for this classification. |
| Inspection Methodology | The inspector does not select the class for the assembly under inspection. |
| Verification of Dimensions | The actual measurements provided in this document (ie. specific part mountings and solder fillet dimensions and determination of percentages) are not required except for referee purposes. |
| The tolerance for magnifications aids is____ | +/- 15% of the selected magnification power. |
| Illumination at the surface of the workstations should be at least___ | 1000lm/m2 [approximately 93 foot candles] |
| Light sources should be selected to prevent__. | shadows |
| IPC-T-50 | Terms and definitions for interconnecting and packaging electronic circuits. |
| Electrostatic Discharge (ESD) | The rapid transfer of static electric charge from one object to another of a different potential that was created from electrostatic sources. |
| Electrical Overstress (EOS) | The internal result of an unwanted application of electrical energy that results in damaged components. |
| Describe the ESD susceptibility symbol. | A triangle with a reaching hand and a slash across both. |
| Static Shielding Packaging | Prevents an electrostatic discharge from passing through the package and into the assembly causing damage. |
| Antistatic (low charging) packaging materials | Used to provide inexpensive cushioning and intermediate packaging for ESD sensitive (ESDS) items. |
| Are eating, drinking, and use of tobacco products in the work area permitted? | No. |
| Should work areas be kept clean and neat? | Yes. |
| What are typical contaminants that might cause soldering and coating problems? | Body salts and oils, and unauthorized hand creams. |
| What should be done to prevent ESD and EOS damage to sensitive components? | All handling, packing and assembly shall be performed at a static-controlled work station. |
| Land width or land diameter of >=.25 to <=.5mm will have a.... | magnification inspection power range of 7.5x to 10x and a maximum referee of 20x. |
| A main goal of the IPC Professional Training and Certification Programs is to.... | provide an understanding of accept/reject criteria to enhance an individual's ability and motivation to consistently and correctly apply the technical discrimination criteria. |
| How long are IPC certs good for? | Master IPC Trainer, Certified IPC Trainer, and Certified IPC Specialist certifications expire after two years. Certification is valid through the last day of the month, regardless of the day of the month the certification was granted. |
| IPC Certifications are personal and portable credentials... | granted to individuals, not the employing company. Certifications are personal property and are retained when changing employment. |
| IPC Certified Specialist recertification may be provided by.. | any Master IPC Trainer or Certified IPC Trainer. |
| Certified IPC Trainers are authorized to grant a single extention of ___ days to a certified IPC specialist. Such exceptions should be noted on the certification document. | 90 |
| What does a certified IPC specialist program accomplish? | Certified IPC Specialist training programs will train, test and certify in the correct application of the criteria for all product classes. |
| Materials authorized for reproduction by the user will be so identified and provided by IPC in ___format, eg. student training materials(previously called student handbooks) | electronic |
| An applicant who completes the training course n fails to pass the cert measurement criteria can retest not sooner than 24 hours but no more than _ days following the original testing, except as authorized in writing by IPC's director of certification | 90 |
| Who do you swear to? | BATMAN |
Created by:
kerinvaughn