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Code and Pract ch 5
Installing Wire Mesh Cable Tray
| Question | Answer |
|---|---|
| 1. WMCT stands for __ (wire module cable tray, wire mesh current tray, wire mesh cable tray, welded mesh cable tray) | wire mesh cable tray |
| 2.All cable trays have to be grounded per the NEC T/F | False |
| 3. All cable trays must be bonded per the NEC T/F | True |
| 4. As a good rule of thumb, ___ additional future growth is recommended on cable tray installations ( 10%,50%,25%,none of the above) | 50% |
| 5. 250.96 identifies the requirements for effective __ ( grounding, bonding, bonding and grounding_ | bonding |
| 6. Which of the following is involved in standards development (NEC, UL, NEMA, CSA, all) | all of the above |
| 7. Reduction of Hazardous Substances (RoHS) is free from six hazardous substances. Which of the following is NOT part of RoHs (Cadmium, Hexavalent Chromium, Lead, Titanium, Mercury, PBB, PBDE | Titanium |
| 8.Twenty-four inch cable tray is most secure when it is center hung T/F | False |
| 9. When handling/installing multiconductor and/or signal cables only, the maximum inside depth cannot exceed __ and the sum of the cross sectional area shall not exceed __ ( 100mm 4"/25%; 150mm 6"/50%; 200mm 8"/100% | 150 mm 6"/50% |
| 10. The sum of the diameters of any mixture of cables (multiconductor, power, lighting, control and signal) which are ___ or larger should not exceed the cable tray width. | 4/0 AWG |
| 11. Based on the NECA Manual of Labor Units, the flexibility and openness of WMCT offers what percentage of faster installation (0-10%; 10-20%; 20-30%; 30-40%; 40-50%) | 20-30% |
| 12. Installation guidelines for installing cable tray are generally governed by referencing NEMA __ Guide. (VE-1;VE-2; VE-3;all) | VE-2 |
| 13. The optimum jaw wire cutter angle for the smoothest wire cut, which is required per 392.100(B) (30 degrees; 45; 60; Any angle is considered satisfactory) | 30 degrees |
| 14. The definition of passivation is ___ (multiple choice)( reduces surface impurities, cover/contain surface impurities, remove surface impuritites, plating process | A process that removes surface impurities which are collected during the manufacturing process(es |
| 15. Manufactured 90 degrees kits are not designed to be field modified to accommodate other angles. T/F | False |