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ch 6-stack1
Term | Definition |
---|---|
Advanced Configuration and Power Interface (ACPI) | specification developed by intel, compaq, phoenix, microsft, and toshiba to control power on computers and other devices |
back-side bus (BSB) | the portion of a proccessor's internal bus that connects the processor to the internal memory cache. |
case fan | a fan inside a computer case used to draw air out of or into the case. |
Centrino | a technology used by intel whereby the processor, chipset, and wireless network adapter are all interconnected as a unit which improves laptop performance. Centrino |
chassis air guide (CAG) | a round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor chassis air guide (CAG) |
Cool’n’Quiet | a feature of amd processors that lowers power requirements and helpkeep a system quiet.Cool’n’Quiet |
Cooler | a combination cooling fan and heat sink mounted on the top or side of the processor to keep it cool. Cooler |
DRAM | the most common type of sysetm memory, it requires refreshing every few milliseconds. DRAM |
dual-core processing | a processor package that contains to core processors,thus supporting four instruction at once. dual-core processing |
Enhanced Intel SpeedStep Technology (EIST) | a processor feature used by intel that steps down processor frequency when the processor is idle to conserve power and lower power. Enhanced Intel SpeedStep Technology (EIST) |
Execute disable bit | a processor security feature by intel that prevents software from executing or reproducing itself if it appers to be malicious.Execute disable bit |
front-side bus (FSB) | the bus between the cpu and the memory on the motherboard. front-side bus (FSB) |
heat sink | a piece of metal with cooling fins that can be attached to or mounted on an intergrated chipsuch as cpu to dissipate heat. heat sink |
hyper-threading | The Intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. hyper-threading |
hyper transport | The AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package.hyper transport |
internal bus | The bus inside the CPU that is used for communication between the CPU's internal components. internal bus |
Level 1 (L1) cache | Memory on the processor die used as a cache to improve processor. performance |
Level 2 (L2) cache | Memory in the processor package, but not on the processor die. The memory is use as a cache or buffer to improve processor performance. Level 2 (L2) cache |