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RNCH6
CHAPTER 6
| Term | Definition |
|---|---|
| Level 1 Cache (L1 Cache) | memory on the processor die |
| Level 2 Cache (L2 Cache) | memory in the processor package, but not the processor die |
| Level 3 Cache (L3 Cache) | a cache farther from the processor core, but still in the processor package |
| Hyper-Threading (Intel) | (Intel) allow each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package |
| HyperTransport | (AMD) allow each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package |
| front-side bus (FSB) | it connects the front side of the processor that faces the outside world |
| internal bus | inside the processor uses the processor housing, data, instructions, addresses, and control signal |
| back-side bus | the portion of the internal bus that connects the processor to the internal memory cache |
| Processor frequency | the speed at which the processor operates internally |
| multiplier | a factor that determines processor frequency |
| overclocking | running a motherboard or processor at a higher speed than the manufacturer suggests |
| multiprocessor platform | a method of improving performance is installing more than one processor on a motherboard |
| multi-core processing | the processor housing contains two or more cores that operate at the same frequency, but independently of each other |
| dual core | has two cores and can support up to four instructions |
| triple core | has three cores and can support up to six instructions |
| quad core | has four cores and can support up to eight instrcutions |
| octo core | has eight cores and can support up to sixteen instructions |
| memory cache | holds data and instructions that the memory controller anticipates the processor will need next |
| dynamic RAM (DRAM) | RAM stored in the memory modules (DIMMS) on the motherboard |
| static RAM (SRAM) | memory in a memory cache |
| microcode | groups of instructions that accomplish fundamental operations, such as comparing or adding two numbers, are permanently built into the processor chip |
| MMX (Multimedia Extensions) | the first technology to support repetitive lopping, whereby the processor receives an instruction and then applies it to a stream of data that follows |
| SSE (Streaming SIMD Extension) | "single instruction, multiple data" it allows the CPU to relieve a single instruction and than execute it on multiple pieces of data |
| 3DNow! | an AMD processor instruction set designed to improve performance with 3D Graphics and other multimedia data |
| SSE2 | has a larger instruction set than SSE, |
| SSE3 | improves on SSE2 |
| SSE4 | improves on SSE3 |
| PowerNow! | by AMD increases performance and lowers power requirements |
| Cool'N'Quiet | by AMD lowers power requirements and helps keep a system quiet |
| Enhanced Intel SpeedStep Technology (EIST) | by Intel steps down processor frequency when the processor is idle to conserve power and lower heat |
| Executable Disable Bit | by Intel is a security feature that prevents software from executing or reproducing itself it appears to be malicious |
| Centrino | an Intel processor, chip-set, and wireless network adapter are all interconnected as a unit, which improves laptop performance |
| thermal compound | placed between the bottom of the cooler heatsink and the top of the processor |
| case fan | a fan that helps draw air out of the case |
| cooler | sits on top of the processor and consists of a fan and a heat sink |
| heat sink | fins that draw heat away from the processor |
| liquid cooling systems | a small pump sits inside the case and tubes move other liquid around components and than away from them to a place where fans can cool the liquid |
| Advanced Configuration and Power Interface (ACPI) | the current set of standards that is used by BIOS, hardware, and the OS manage power |
| S1 State | the hard drive and monitor, and processor are turned off and everything else runs normally |
| S2 State | the hard drive, monitor, and processor are turned off, also called standby or sleep mode |
| S3 State | everything is shut down except RAM and enough of the system to respond to a wake up call such as pressing the keyboard or moving the mouse. also called sleep mode, suspend mode, standby mode, or suspend to RAM |
| S4 State | is called hibernation, in hibernation, everything in RAM is copied to a file on the hard drive and then the system shuts down, when a power button is pressed, the system does not have to go through the slow boot process. |
| P State | save power by lowering the CPU frequency and voltage |
| C State | used by the processor to stop its internal operations to conserve power |
| chassis air guide (CAG) | a round air duct that helps pull and direct fresh air from outside the case to the cooler and the processor |
Created by:
rnovalski62
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